August Technology Enhances Wafer Bump Inspection Product Family; New 3Di-7500 and 3Di-8500 Expand Product Offering.Business Editors & High-Tech Writers August Technology (Nasdaq:AUGT) today introduced the 3Di-7500 and 3Di-8500, two new additions to the 3Di Series of inline automated inspection systems. These new systems compliment the existing 3Di-8000 by expanding the price performance offering to August Technology's customers. The new 3Di-8500 offers the highest performance bump metrology and defect inspection available on the market today, while the 3Di-7500 offers a lower cost, yet high accuracy alternative for applications such as process and engineering development. The 3Di-8500 has demonstrated throughputs over 18 wafers per hour for 200 millimeter One thousandth of a meter, or 1/25th of an inch. See metric system. wafers, performing 100% coverage for both 2D and 3D wafer bump inspection. "The diversity of 3D metrology and inspection applications in the growing advanced packaging market requires a family of solutions. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Dataquest, the number of bumped wafers is expected to grow by 288% over the next four years," explained Jeff O'Dell, August Technology's chairman and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. . "Our more complete 3Di product family now addresses both higher throughput and lower cost requirements, enabling customers to choose the system that best fits their needs. The 3Di-7500, 8000, and 8500 all use August Technology's breakthrough Rapid Confocal confocal see confocal microscopy. Sensor (RCS (1) (Remote Computer Service) A remote timesharing service. (2) (Revision Control System) A Unix utility that provides version control. RCS - Revision Control System ) technology, making system field upgrades and tool-to-tool measurement comparisons more practical." All 3Di Series systems are available today and offer the unique ability to perform field proven 2D and 3D inspection in a single system. The 3Di Series systems are all capable of up to 300mm wafer inspection, both whole wafer and sawn wafer on film frame. August Technology Corporation, based in Bloomington, Minnesota Bloomington is a city in Hennepin County, Minnesota, and a southern suburb of Minneapolis. As of 2005, it had a population of 84,347, making it the largest Twin Cities suburb, and the fifth largest city in the state[1]. , is a leading supplier of automated visual defect inspection equipment for the microelectronic industries and has established worldwide service and sales representation. The inspection solutions designed, manufactured and marketed by August Technology provide critical product and process enhancing information enabling microelectronic device manufacturers to drive down costs and time to market. August Technology is a founding member of the Advanced Packaging and Interconnect Alliance (APiA) and an active member of the Die Products Consortium (DPC DPC Department of Premier and Cabinet (Victoria, Australia) DPC Dutch Power Cows DPC Deferred Procedure Calls (Microsoft Windows NT 4. ). Additional information can be found by visiting August Technology's web site at www.augusttech.com. |
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