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Atmel Introduces a New 0.35 Micron CMOS Radiation Hard ASIC Library Dedicated to Space Applications.


Business Editors/High-Tech Writers

NANTES, France--(BUSINESS WIRE)--Oct. 30, 2001

Atmel(R) Corporation (Nasdaq:ATML ATML Automatic Test Markup Language
ATML Automated Test Markup Language
) announced today the release of the MH1RT series, a set of ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor.  Sea of Gates 0.35 micron libraries which provide the Aerospace industry with a level of integration of up to 1.6 million usable gates, and a capability of radiation hardness up to 300 K Rads.

Developed during a three-year partnership program started late in 2000 between the Centre National d'Etudes Spatiales (CNES CNES Centre National d'Etudes Spatiales (French Space Agency) ), the European Space Agency European Space Agency (ESA), multinational agency dedicated to the promotion, for exclusively peaceful purposes, of cooperation among European states in space research and technology.  (ESA) and Atmel, the MH1RT libraries encompass all the specific digital functions and buffers necessary for space designs, such as LVDS(1) and PCI (1) (Payment Card Industry) See PCI DSS.

(2) (Peripheral Component Interconnect) The most widely used I/O bus (peripheral bus).
(2) buffers, SEU(3) immune DFFs(4), and cold sparing capability buffers. All ASICs can be designed with either 3.3 V, 3 V or 2.5 V libraries, and the buffers are capable of interfacing either with 3 V or 5 V logic.

Following its partnership strategy with leading customers, Atmel has successfully prototyped multiple radiation hard MH1RT ASICs, representative of the maximum gate count complexity, including multiple complex and compiled memory blocks. These new ASICs libraries are available under the QML V 5962-01B01 Standard Military Drawing, the highest complexity currently listed by Defense Supply Center Columbus (DSCC).

Dominique de Saint Roman, marketing manager for Aerospace ASIC at Atmel, said "Our objective is to offer ever increasing gate integration capability, combined with the cells, buffers and IPs necessary to open the way towards the future generation of Radiation-Tolerant System on Chip solutions."

The available set of matrix and package combinations can address pin count complexity up to 472 pins, using a hermetic ceramic BGA type (the Ceramic Land Grid Array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB.  combined with a Solder Column Interposer in·ter·pose  
v. in·ter·posed, in·ter·pos·ing, in·ter·pos·es

v.tr.
1.
a. To insert or introduce between parts.

b. To place (oneself) between others or things.

2.
).

Design kits are available for Cadence/Verilog, Mentor and Synopsys platforms. They include all the libraries for simulation and synthesis. Customer support is provided by dedicated design centers in Europe (London, Milan, Munich, Nantes and Paris) and the U.S. (San Jose, Calif.).

The development of next generation of libraries, based on standard cells characterized on a 0.25 micron CMOS hardened technology, is ongoing and should be released by next year. It will allow ASIC designs with complexity above 5 million gates.

(1) LVDS: Low Voltage Differential (hardware) Low Voltage Differential - (LVD) A method of driving SCSI cables that will be formalised in the SCSI-3 specifications. LVD uses less power than the current differential drive (HVD), is less expensive and will allow the higher speeds of Ultra-2 SCSI. LVD requires 3.  Swing

(2) PCI: Peripheral Component Interconnect See PCI.

(hardware) Peripheral Component Interconnect - (PCI) A standard for connecting peripherals to a personal computer, designed by Intel and released around Autumn 1993. PCI is supported by most major manufacturers including Apple Computer.
 

(3) SEU: Single Event Upset

(4) DFF: Data Flip Flop

About Atmel

Founded in 1984, Atmel Corporation is headquartered in San Jose, Calif. with manufacturing facilities in North America and Europe. Atmel designs, manufactures and markets worldwide, advanced logic, mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also a leading provider of system-level integration semiconductor solutions using CMOS, BiCMOS, bipolar SiGe, and high-voltage BCDMOS process technologies.

Note to Editors: Atmel, the Atmel logo and combinations thereof and others contained herein, are trademarks of Atmel Corporation. Terms and product names in this document may be the trademarks of others.

Information Atmel product information may be retrieved at http://www.atmel-wm.com/spaceasic.htm
COPYRIGHT 2001 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Date:Oct 30, 2001
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