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Asyst Technologies Announces Webcast to Discuss The Company's Connectivity Solutions Business Strategy.


Business Editors/Technology Writers

FREMONT, Calif.--(BUSINESS WIRE)--April 9, 2002

ASYST Technologies, Inc. (Nasdaq NM: ASYT), a leading provider of integrated automation solutions for the semiconductor manufacturing industry, today announced that it has created a new organization to address the emerging market for equipment connectivity solutions. In implementing its strategy, the company announced that it has reached a definitive agreement to acquire the assets of domainLogix Corporation (DLC (1) (Data Link Control) See data link and OSI.

(2) (Data Link Control) The data link layer protocol (layer 2) that is used in IBM's SNA networking. See SNA, data link protocol and Microsoft DLC.
), Austin, Texas, and will partner with Satyam Computer Services Data processing (timesharing, batch processing), software development and consulting services. See service bureau, SaaS and ASP.  Ltd. (NYSE NYSE

See: New York Stock Exchange
: SAY) of India.

A webcast will be held to discuss Asyst's Connectivity Solutions business strategy on Tuesday, April 9, 2002, at 5:30 p.m. Eastern Time.

This call is being webcast by CCBN CCBN Central Coast Bancorp
CCBN Charles County Business Network
 and can be accessed at Asyst's web site at www.asyst.com.

The webcast is also being distributed over CCBN's Investor Distribution Network to both institutional and individual investors. Individual investors can listen to the call through CCBN's individual investor center at www.companyboardroom.com or by visiting any of the investor sites in CCBN's Individual Investor Network. Institutional investors can access the call via CCBN's password-protected event management site, StreetEvents (www.streetevents.com).

Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase overall equipment effectiveness The introduction to this article provides insufficient context for those unfamiliar with the subject matter.
Please help [ improve the introduction] to meet Wikipedia's layout standards. You can discuss the issue on the talk page.
, improve yields and increase fab throughput. The company offers a broad range of 200mm and 300mm solutions that enable the safe and rapid transfer of wafers and information between process equipment and the fab line throughout the IC fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration.
 process, while reducing IC damage caused by human, environmental, mechanical and chemical factors.
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Publication:Business Wire
Geographic Code:1USA
Date:Apr 9, 2002
Words:260
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