Browse Ashmore, Clive

1-26 out of 26 article(s)

Title	Date	Words
Ensuring accurate placement in the tooling nest: combining clamping and snugging in a single board handling method.	Oct 1, 2009	654
Going under: when it comes to understencil cleaning, the devil's in the details.	Aug 1, 2009	844
Have it your way: designing in flexibility isn't easy, but it's a must.	Jun 1, 2009	791
Whoops! Forgot the paste: there is one process control item that is remarkably simple, yet often forgotten.	Apr 1, 2009	684
The next leap of faith? Embedded passives are inevitable, and fabricators must be brought up to speed.	Feb 1, 2009	725
Stencil horror stories: why a 100 mm board shouldn't be processed with a 300 mm squeegee.	Jul 1, 2008	919
Playing the angles: why a 55[degrees] squeegee angle enhances print quality.	May 1, 2008	694
Printing verification and traceability tools: used together, each product can be traceable to the board level.	Mar 1, 2008	784
Like riding a bike? Software can be the stabilizer for a "balanced" process.	Jan 1, 2008	870
Diagnosing high-volume medical processes: novel printing tools and methods deliver the cure.	Nov 1, 2007	859
Heterogeneous assembly: can large and small devices be processed in harmony?	Sep 1, 2007	765
Understencil cleaning: optimizing a necessary evil; Controlling cleaning inputs is essential to achieving a clean stencil.	Jul 1, 2007	784
0.3 mm CSPs: closer than you think; Revealed: the best-suited material set for next-generation chips.	May 1, 2007	806
Closed loop TIM processing: printers offer better process control and cost savings over dispensers.	Jan 1, 2007	682
Automated stencil inspection: miniaturization changes the rules for stencil manufacture.	Nov 1, 2006	755
Die attach goes mainstream: for IC deposition, printer platforms are supplanting dispensers on die bonders.	Sep 1, 2006	694
No more friction: new board transport systems can aid printer throughput.	Jul 1, 2006	642
Upfront evaluation pays big dividends: mom was right; it's easier to clean up as you go along.	May 1, 2006	609
From SPC to DPMO: DPMO is the superior means for determining equipment performance.	Mar 1, 2006	811
Using a printer in chip attachment and encapsulation: part two of a look at how traditional SMT processes address semiconductor packaging.	Jan 1, 2006	448
Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.	Nov 1, 2005	581
Maximizing mixed-technology applications: how pin-in-paste cuts wave soldering time and costs.	Sep 1, 2005	642
Choosing the right stencil: plastic makes its mark, but for 0.5 mm pitch laser-cut or electroformed are best.	Jul 1, 2005	794
Beyond assembly: alternative applications for high accuracy screen printing.	May 1, 2005	609
Will your printing process be affected by Pb-free? Paste properties of lead-free solder alloys differ considerably from tin-lead.	Mar 1, 2005	698
How mass-imaging is chaning dispensing: printing thousands of dots in a single stroke.	Jan 1, 2005	658