Asetek Cools Hewlett Packard's New HP Firebird 803 Compact Gaming Tower.

Asetek Solution Provides Total Liquid Cooling for the HP Firebird's CPU, Chipset, and Two MXM Graphics Cards

SAN JOSE, Calif. -- Asetek announced today that its industry-leading liquid cooling solution has been selected by Hewlett Packard for use in its innovative, compact HP Firebird 803 Tower with Voodoo DNA. By using Asetek technology to cool all major components -- CPU, Chipset, and two MXM graphic cards -- HP was able to pack a lot of performance into a small footprint package while achieving a unique deadly silent, high performance, and energy efficient system.

"Enthusiasts and power users no longer need to tolerate the annoying noise common in high performance systems," said Jim Handy, Chief Analyst at Objective Analysis. "This high growth market segment is demanding ever increasing performance in dramatically smaller form factors at little to no noise. This complicates thermal management and is driving major OEMs to adopt liquid cooling as a solution to the thermal dilemma."

Enthusiasts need extreme performance in a quiet machine that takes less space. Packing a lot of CPU and graphics power into a smaller unit demands a solution for efficiently moving heat out of the system without noise that can adversely affect the computing experience. HP Blackbird proved Asetek's ability to deliver a robust OEM thermal solution. HP and Asetek collaborated to extend the solution to cool additional major components and craft a solution for Firebird that delivers low noise and high performance in a substantially smaller chassis.

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