Applied Materials and OnTrak Systems form alliance for integrated CMP cleaning technology.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Jan. 24, 1996--Applied Materials Inc. and OnTrak Systems Inc. have entered into a strategic alliance that will enable a version of OnTrak's DSS-200 wafer cleaning system to be integrated with Applied Materials' new Mirra CMP (chemical mechanical polishing) system. Together the technologies will provide a completely automated polishing and cleaning solution for CMP.

The integrated solution will offer a number of benefits to chip manufacturers, including optimized cleanroom space, increased wafer throughput and a fully characterized CMP process. The DSS-200 and Mirra systems will continue to be sold separately by each company, with the optional integrated versions expected to be available for shipment beginning in the third calendar quarter of 1996. Service and support of the CMP and cleaning systems in customer fabs will be provided by Applied Materials on OnTrak, respectively.

Dr. Jeffrey Marks, general manager of Applied Materials' CMP product development group, said, "This alliance takes advantage of both companies' strengths - Applied Materials' in process technology, and OnTrak's in-depth knowledge of CMP cleaning processes - in a way that will help us rapidly introduce the Mirra CMP system to our global customer base."

OnTrak's chief technology officer, Dr. Wilber Krusell, added, "We have spent the past three years characterizing a cleaning process for each major CMP system on the market. We will now integrate the DSS-200 with Applied Materials' Mirra CMP system."

Jerry Cutini, OnTrak's executive vice president of sales and marketing, noted that the alliance is part of OnTrak's open architecture strategy for CMP process integration that allows users to leverage OnTrak's expertise in CMP cleaning. "OnTrak's growing global customers are requesting a complete CMP solution that utilizes the DSS-200 system. As a result, we have developed an open architecture strategy allowing us to integrate the DSS-200 with polishers such as the Mirra."

For Mirra systems that will be integrated with OnTrak's DSS-200 cleaning system, Applied Materials will be responsible for system integration at the customer site, ensuring compatibility of automation software and control systems. Due to the high throughput of the DSS-200 and the Mirra CMP system, throughput of the combined systems will be optimized to the 60 wafer-per-hour level, retaining the floorspace advantages of the Mirra's small footprint design.

OnTrak Systems Inc. is a leading provider of semiconductor capital equipment for CMP. Its primary product, the DSS-200, is a double-sided, single-wafer cleaning system used in a variety of advanced applications. OnTrak is headquartered in San Jose, Calif., and has sales, service and manufacturer's representative offices in strategic locations worldwide.

Applied Materials is a global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. -0-

NOTE TO EDITORS: Both OnTrak and Applied Materials report that this alliance will not prevent either company from pursuing any new product development efforts in CMP and cleaning or continuing any efforts currently underway.

CONTACT: Applied Materials Inc.

Charles Lewis, 408/748-5819 (media)

Bill Ong, 408/235-6232 (financial)

or

OnTrak Systems Inc.

Jerry Cutini, 408/577-1010

or

MCA Inc.

Sheryl Moreno, 415/968-8900