Applied Materials and IMEC enter into strategic research collaboration agreement for process technology; IMEC's Advanced Semiconductor Processing Group to work with Applied Materials' PVD Division to develop advanced metallization technology.SUNNYVALE, Calif.--(BUSINESS WIRE)--Aug. 19, 1996--Applied Materials Inc. (Santa Clara Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif.) and IMEC (Leuven, Belgium), an independent research and development organization that develops and licenses microelectronic technology worldwide, today announced that Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar has entered into a three year collaboration agreement to develop advanced metallization Met`al`li`za´tion n. 1. The act or process of metallizing. process technology critical to 0.25 micron semiconductor manufacturing. As part of this agreement, Applied Materials will install an Endura HP PVD PVD abbr. peripheral vascular disease PVD Peripheral vascular disease, see there system at IMEC and effective September 1996, Applied Materials will become a member of IMEC's Industrial Affiliates Program (IAP (Internet Access Provider) See ISP. IAP - Internet Access Provider ) on Advanced Metallization. The Endura HP PVD system includes an advanced sputter etch To create a design in a material by digging out the material. The circuit designs on printed circuit boards and chips are etched by acid. See chip and printed circuit board. module, Chorent titanium/titanium-nitride and Aluminum Physical Vapor Deposition Please help recruit one or [ improve this article] yourself. See the talk page for details. (Al-PVD) chambers. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Karen Maex, head of IMEC's Silicides and Metallization group, "To solve increasingly difficult problems in device scaling, the installation of this equipment helps us further explore the limits of Al-PVD-based metallization processes." The research is being conducted at IMEC's facilities in Leuven, Belgium by IMEC researchers in close cooperation with Applied Materials' PVD Division in Santa Clara. According to Gilbert Declerck, Vice-President of IMEC's Advanced Semiconductor Processing Division, "This collaboration fits into IMEC's strategy to choose strategic suppliers within the framework of its Industrial Affiliation Programs. This collaboration makes our process development programs even more valuable to our semiconductor industry research partners." G. M. Amico, Applied Materials' Regional Product Manager, Europe, noted, "The Applied Materials Endura PVD platform and advanced process chambers enables IMEC to develop state-of-the-art metallization technology with their research partners that can be readily transferred to production." Applied Materials is the industry's leading manufacturer of PVD systems, with Endura PVD systems installed in almost every major semiconductor fab See fab. worldwide. The Endura HP PVD is based on a multi-chamber dual loadlock architecture that allows the wafer to move through a staged vacuum sequence to achieve a base pressure of 10(-9) Torr to ensure maximum purity of the deposited films. Some of the specific issues being investigated in IMEC's Industrial Affiliates Program on Advanced Metallization include: -- optimization of contact and via fill processes: contact and via clean; titanium/titanium nitride nitride Any of a class of chemical compounds in which nitrogen is combined with an element of similar or lower electronegativity, such as boron, silicon, and most metals. Some examples of nitrides include boron nitride, calcium nitride, aluminum nitride, and cyanogen. deposition and its conformality; tungsten deposition and etchback; alternative filling with a less than 400:C Al-PVD process; electrical characterization of via and contact resistance; yield of contact and via chains. -- optimization of the metal runners: texture, grain size, composition of the metal stack; new aluminum alloys; effects of passivation passivation the final stage in instrument manufacture, passing the finished instruments through a bath of nitric acid which removes foreign particles and promotes the formation of a protective coating of chromium oxide. . -- electromigration studies: fast migration tests with an emphasis on the detection of early failures; impact of materials and processing parameters; influence of scaling; impact on design rules. -- stress migration aspects: evaluation/optimization of measurement techniques; impact of materials and processing. -- new integration schemes: damascene technology with aluminum and copper; low k dielectrics; electroless copper deposition. About IMEC: IMEC was founded in 1984 and today is the largest independent research and development center of its kind in Europe. IMEC employs over 600 people. Its 36,000 sq. ft. clean room is dedicated to advanced research and development into semiconductor processing technologies. Its nearly $70 million revenue is derived from agreements and contracts with government agencies, aerospace and semiconductor industry companies worldwide. CONTACT: For IMEC, USA Georgia Marszalek, 415/345-7477 e-mail: georgia@netcom.com or IMEC, Europe Marianne Van den Broeck, (32) 16 28 14 91 e-mail: marianne@imec.be or IMEC, Belgium G. Declerck, (32) 16 28 13 20 e-mail: declerck@imec.be or Delos Research Group William van Cleemput, 408/733-8000 e-mail: 72740.2015@compuserve.com or Applied Materials Inc. Betty Newboe, 408/563-0647 e-mail: Newboe_Betty@amat.com |
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