Applied Materials Revolutionizes Defect Review with Industry's First Automated In-Line SEM/FIB System.

To download high-resolution, print-ready JPEG images, click on the thumbnail image above.

WARNING: these images are

very large (800K+)

Click here for caption

Photo Editors/Business Editors/High-Tech Writers

NOTE TO MEDIA: Multimedia assets available

A photo is available at URL:

http://www.businesswire.com/cgi-bin/photo.cgi?pw.112003/bb2

SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 20, 2003

Applied SEMVision(TM) G2 FIB Is Single-System Solution to Rapidly

Finding the Root Cause of Defects in the Production Line

Applied Materials, Inc. (Nasdaq:AMAT) launches its revolutionary Applied SEMVision G2 FIB Defect Analysis system, the first in-line production tool to integrate advanced defect review SEM* capability with automated FIB (focused ion beam) cross-sectioning and EDX* analysis technology in one system. With its patented ClearCut(TM) one-stop review and analysis solution, chipmakers can now perform high-speed, high-resolution automatic SEM review followed by FIB analysis of defects in minutes as part of their in-line review scheme. This unique capability enables a major step forward in production efficiency, yield and fab profitability.

"The new Applied SEMVision G2 FIB system gives our customers a vital new capability that breaks a critical fault-correction bottleneck," said Dr. Gilad Almogy, Vice President and General Manager of Applied Materials' Process Diagnostics and Control product business group. "Our customers are intensely interested in this fast, closed-loop solution because it brings the most effective yield management methodology into the production line. This new system also is based on the market-leading SEMVision G2, which is used in every 300mm fab worldwide, providing customers with the latest in process automation and fab connectivity."

At the heart of the Applied SEMVision G2 FIB system is its patented ClearCut technology, combining SEM, FIB and EDX capabilities on a single platform. Traditionally, dual SEM/FIB systems are designed with both SEM and FIB pointing at the same location on the wafer in a cross-beam configuration, which limits SEM performance. With the SEMVision G2 FIB, the SEM and FIB are in a parallel position, enabling shorter working distances under both the SEM and FIB, a variety of advanced imaging technologies, including MPSI,(TM) voltage contrast and high aspect ratio imaging, and material analysis by EDX.

Ted Hagler, Section Manager for Inline Defect in R&D at Micron Technology Inc., said, "Yield and cycle are critical to the success of any fab. Full defect characterization is required in order to identify the root cause quickly in an effort to prevent or minimize further impact to the quality of product. Adding fast, user friendly, automated inline DR-SEM* FIB capability aids in the immediate resolution of defect source and composition, identifying which process to repair, which in turn, increases production efficiency."

Multiple Applied SEMVision G2 FIB systems are already being used by leading memory and logic customers. New orders for the system have been received from customers in Asia, North America and Europe.

Applied Materials (Nasdaq:AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' web site is www.appliedmaterials.com.

*SEM: scanning electron microscope 

EDX: Energy Dispersive X-Ray

MPSI: multi-perspective SEM imaging

DR-SEM: defect review SEM

Note: A photo is available at URL: http://www.businesswire.com/cgi-bin/photo.cgi?pw.112003/bb2