Applied Materials Introduces High Productivity CVD Solution For 0.5 Micron to 0.25 Micron Gap Fill; SACVD DxZ Centura Delivers Low-Risk, Device-Proven IMD Gap-Fill Technology at a High System Throughput.

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 14, 1996--Applied Materials Inc., the leading supplier of CVD systems worldwide, has extended its leadership position in intermetal dielectric (IMD) processing by applying its Sub-Atmospheric Chemical Vapor Depositions (SACVD) technology to the advanced DxZ chamber on the Centura platform.

Targeted for the high-volume fabrication of interconnect device structures at 0.5 micron, 0.35 micron, and 0.25 micron geometries, the new SACVD DxZ Centura provides a production-proven, one-step IMD deposition process at a low cost and high throughput.

"This migration of SACVD technology to our latest platform and chamber is a key part of our strategy to quickly transistion enabling technologies toward higher levels of productivity, so our customers can use the advanced technology benefits in cost-sensitive applications," explained Dr. Ashok Sinha, president of Applied Materials' CVD Product Business Group. "Having SACVD capability on the Centura adds to our comprehensive CVD capability and gives our customers extendibility for device generations into the next century."

Applied Materials' DxZ chamber features a symmetric, small-volume design with ceramic components. Its optimum pumping design and high-powered generator yield a 30 percent faster chamber clean and a zero consumables cost. The DxZ chamber performs an in situ integrated process sequence of PETEOS and SACVD films -- uniquely combining the gap-fill SACVD and cap layer PECVD in a simple, one-step, one chamber deposition process. This unique capability ensures excellent gap fill and defect performance at a low cost, while eliminating requirements for multiple tools and associated excessive handling.

Dr. Romek Nowak, general manager of the company's DCVD Division II, said, "Industry acceptance of SACVD processing capabilities is clearly evident. There are already 150 of our SACVD systems installed at customer sites around the world in production for 0.5 micron and 0.35 micron IMD applications. The universal Centura platform allows customers the flexibility of running multiple processes today, with extendibility to next-generation applications. The distinctive capability of the DxZ chamber to deposit both thermal and PECVD TEOS films ensures a long product life and makes it unique in CVD equipment."

The advanced single-wafer, multi-chamber architecture of the Centura platform greatly enhances system productivity. More than 350 Centuras are currently in use at manufacturing sites around the world, and the accelerating shipments of the Centura platform make it the primary multi-chamber platform for the company's etch, CVD and high-temperature processes.

Standard features of the SACVD DxZ Centura mainframe include a dual-speed, magnetically coupled robot for high throughput and reliability, loadlocks with tilt-out capability for ergonomic operation, and an ultrahigh purity gas panel for contamination-free manufacturing. Its layout is optimized for a high degree of accessibility and serviceability. In addition, the multi-slot cooldown chamber eliminates cooldown time as a process bottleneck and allows use of plastic cassettes.

Typical process performances for the SACVD DxZ Centura include a throughput of more than 20 wafers per hour for a complete IMD stack, including gap fill and thick capping layer. Wafers are then ready for subsequent CMP processing.

Customers in the U.S., Japan, Korea and Asia-Pacific regions have made advance commitments for multiple SACVD DxZ Centura systems for the manufacture of advanced logic and DRAM devices. Production shipments are expected to begin in the fourth fiscal quarter of 1996. Base price for the SACVD DxZ Centura starts at $1.9 million for a two-chamber system; actual price depends on configuration and options.

Applied Materials Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market under the symbol "AMAT." Applied Materials web site is http://www.Applied Materials.com.

CONTACT: Applied Materials Inc.

Betty Newboe, 408/563-0647 (editorial)

Bill Ong, 408/235-6232 (analysts)