Applied Materials Introduces Endura HP Liner/Barrier Systems; Endura Platform Offers the Latest PVD and CVD Ti/TiN Technologies for Less Than or Equal To 0.25 micron Device Designs.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 2, 1996--Applied Materials, Inc., the leading supplier of metal deposition systems worldwide, expands its highly successful Endura HP Metal product line with two new system options for depositing titanium (Ti) and titanium nitride (TiN) liner/barrier films in less than or equal to 0.25 micron, high-aspect-ratio contact and via structures. The Endura HP Liner/Barrier is available in two standardized configurations, featuring either CVD or Ion Metal Plasma (IMP) TiN technologies. Each system is optimized for high throughput, productivity and low cost of ownership.

"Applied Materials is providing a range of optimized metallization strategies that will allow our customers to achieve the highest performance possible for their individual device designs," said Dr. Jaim Nulman, Applied Materials' managing director and global product manager for PVD. "Every customer has different requirements for interconnect structures, since these areas have the greatest impact on device speed and performance. Our CVD TiN and IMP TiN technologies have distinct deposition and physical characteristics, so customers can choose processes based on their own interconnect schemes."

Both Liner/Barrier systems use the Endura HP Metal platform and come pre-configured with degas and Preclean II chambers for wafer surface preparation, and a Vectra IMP chamber for Ti deposition. For TiN, customers may choose either the Vectra IMP or TxZ CVD technologies to offer a system throughput of 45-55 wafers per hour, depending on film type and thickness.

"Putting Vectra IMP TiN or CVD TiN TxZ chambers in a standard configuration on the Endura HP Metal platform lets us offer our customers a choice of high productivity liner metallization systems at a lower cost compared to customized orders," noted Dr. Nulman. "These systems, combined with our recently-announced Liner TxZ Centura, greatly enhance the range of liner/barrier options now available to our customers."

First introduced in 1990, the single-wafer, multi-chamber Endura PVD system is one of the most successful products ever made for semiconductor manufacturing; more than 900 Endura systems are currently in use worldwide. Vectra IMP technology, introduced in July 1996, offers highly directional, vertical deposition of cost-effective Ti and TiN liner/barrier films in less than or equal to 0.25 micron contacts and vias.

The CVD TiN TxZ chamber is the company's latest development in CVD TiN technology. It offers the advantages of CVD TiN--highly conformal films with uniform coverage on the sides and bottom of contacts and vias -- in Applied Materials' latest, resistively-heated "xZ"series CVD chamber.

In addition to the Endura HP, Applied Materials also offers CVD TiN TxZ technology on its Centura platform. Introduced in September, the Liner TxZ Centura combines CVD TiN with Coherent PVD Ti, offering high productivity liner/barrier technology in a smaller footprint with lower capital cost. Ion metal plasma (IMP) Ti technology will be available on the Centura platform in mid-1997.

Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market under the symbol "AMAT." Applied Materials' web site is http://www.AppliedMaterials.com

CONTACT: Applied Materials, Inc.

Betty Newboe, 408/563-0647 (editorial/media)

Susan Overstreet, 408/748-5227 (financial community)