Applied Materials Demonstrates Next-Generation Interconnect Solutions for Breaking the Gigahertz/Gigabit Barrier.SAN FRANCISCO--(BUSINESS WIRE)--July 13, 1998--
Equipment Set Solutions for Aluminum, Copper and Low k Enable
Extension of Moore's Law "The number of transistors and resistors on a chip doubles every 18 months." By Intel co-founder Gordon Moore regarding the pace of semiconductor technology. He made this famous comment in 1965 when there were approximately 60 devices on a chip.
Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar , Inc. today announced at the Semicon West 98 trade show that the company has demonstrated a full range of processes and solutions that will enable chipmakers to build interconnect structures for all types of semiconductors. These interconnects range from aluminum-based designs to the copper and low dielectric constant dielectric constant
See permittivity. (low k) designs that will all be part of tomorrow's gigahertz and gigabit device generations.
The interconnect is the key structure in advanced chip designs. New interconnect materials and fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration. strategies will enable products such as embedded designs, systems-on-a-chip, high-density memories and ultra-high speed microprocessors. For the consumer, increased chip performance will mean high resolution displays with 3-D imaging for business and entertainment, real-time video conferencing See videoconferencing.
(communications) video conferencing - A discussion between two or more groups of people who are in different places but can see and hear each other using electronic communications. and a host of other emerging applications, including graphics-intensive internet communications.
"Moore's Law for microelectronic chips has driven the growth of the trillion dollar global electronics industry," noted Dr. Ashok Sinha, president of Applied Materials' Metal Deposition Product Business Group. "Applied Materials has a comprehensive and powerful approach to next-generation interconnect technology that is aimed at continuing Moore's Law by enabling the cost-effective production of gigahertz-speed microprocessors and gigabit-density DRAMs. Our Total Solutions(tm) program brings to customers its most advanced deposition, etch, chemical mechanical planarization (CMP CMP (cytidine monophosphate): see cytosine.
(1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information ), thermal processing and inspection technologies -- integrated and optimized into high-performance process sequences for creating the entire interconnect structure of an integrated circuit."
For gigahertz/gigabit generation devices, semiconductor manufacturers are considering several interconnect fabrication strategies, including single damascene, dual damascene and conventional "plug and pattern" designs. Each of these different design schemes requires fundamental changes in materials and processing techniques.
"Applied Materials has an equipment set solution for any combination of aluminum, copper and low (k) dielectrics that our customers wish to use. We've already demonstrated process results using these solutions for the complete range of interconnect structure design schemes being considered for giga-generation devices. By integrating and optimizing all parts of the process flow, we give customers many process options that can potentially save them considerable time in process development, system qualification and, ultimately, time-to-market," Sinha said.
Applied Materials' PVD PVD
peripheral vascular disease
PVD Peripheral vascular disease, see there (physical vapor deposition This article or section is in need of attention from an expert on the subject.
Please help recruit one or [ improve this article] yourself. See the talk page for details. ) products for both aluminum and copper-based device designs are being used by virtually every major semiconductor manufacturer worldwide. For example, the Endura(R) Electra Cu(tm) system was the first product in the market for depositing critical tantalum-based barrier and copper seed layers to enable copper interconnects. The Endura Electra Cu technology is currently being used by more than a dozen chipmakers. Applied Materials also has successfully demonstrated several alternatives for copper bulk fill, including electroplating electroplating: see plating.
Process of coating with metal by means of an electric current. Plating metal may be transferred to conductive surfaces (e.g., metals) or to nonconductive surfaces (e.g. and dry fill CVD/PVD technologies. A versatile copper chemical mechanical planarization (CMP) process has also been demonstrated on Applied Materials' Mirra(R) CMP system for post-deposition polishing.
Low k dielectric films, which complement copper film in enabling advanced chip designs, have also been demonstrated by Applied Materials. These low k films include fluorinated fluorinated
material to which a fluoride has been added, e.g. water for human consumption treated as a prophylaxis against tooth decay. silicate glass (FSG See Linux Foundation. ) using the Ultima HDP-CVD Centura(R) and a silicon-based "Black Diamond" technology. Both dielectric and copper metal etching technologies are being evaluated for various interconnect designs. The Dielectric Etch IPS(tm) Centura has shown excellent results in the difficult applications required for dual damascene etching, both with SiO2 and low k films. A remarkable copper etch technology has also been demonstrated using the Metal Etch DPS Minicomputer series from Bull HN.
1. (language, text) DPS - Display PostScript.
2. (language) DPS - A real-time language with direct expression of timing requests.
["Language Constructs for Distributed Real-Time PRogramming", I. (tm) Centura system for potential use in conventional "plug and pattern" interconnect architectures.
For more information on Applied Materials' full range of processes and solutions for the gigahertz/gigabit device generations, visit the company's web site at http://www.AppliedMaterials.com. Applied Materials will also be exhibiting its Total Solutions interconnect approach at Semicon West 98 in San Francisco, Calif., on July 13-15 in Booth No. 1026.
Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol "AMAT AMAT Applied Materials (stock symbol)
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CONTACT: Applied Materials, Inc.
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