Applied Materials Awarded Two Additional Patents for Low k Dielectric Technology.Business Editors/High-Tech Writers SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif.--(BUSINESS WIRE)--Oct. 31, 2001 Extensive Patent Portfolio Strengthens Applied Materials' Leadership in Low k Technology Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar , Inc. (Nasdaq:AMAT AMAT Applied Materials (stock symbol) AMAT Average Memory Access Time AMAT Automatic Message Accounting Transmitter AMAT Anti-Materiel (bomb or mine) AMAT Ageing Management Assessment Team ) today announced the grant of patents No. 6,287,990 and No. 6,303,523 by the U.S. Patent & Trademark Office covering advanced low k dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not CVD CVD Cardiovascular disease, see there (chemical vapor deposition Vapor deposition Production of a film of material often on a heated surface and in a vacuum. Vapor deposition technology is used in a large variety of applications. ) film technology used to increase the speed and performance of next-generation chips. To date, Applied Materials has been awarded more than 15 CVD low k-related patents that enhance its powerful patent portfolio in this strategic technology area. "These new patents cover some of our most important intellectual property regarding low k dielectric films," said Dr. Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Business Group. "They protect our Black Diamond(TM) technology and demonstrate our leadership in providing customers with innovations to meet their next-generation chip design requirements." Issued in September and October 2001, both patents center on Applied Materials' Black Diamond technology, a family of organosilicate glass-based low k dielectric products. Introduced in November 1998, Black Diamond enables chipmakers to cost-effectively integrate a low k dielectric (k less than 3.0) using conventional CVD equipment and silicon-based materials. Black Diamond can be used with Applied Materials' BLOk(TM) dielectric CVD barrier and etch To create a design in a material by digging out the material. The circuit designs on printed circuit boards and chips are etched by acid. See chip and printed circuit board. stop film to further lower the overall k value of chip interconnect structures. Black Diamond technology has achieved growing global acceptance, with 17 chipmakers working with it in development. The product line's first film, targeting 0.13-0.10 micron devices, is the industry's leading production-worthy low k dielectric material and has demonstrated the unique capability to be used on every level for 8-level copper interconnects. Customers are expected to ship chips that integrate Black Diamond in 2002. Applied Materials (Nasdaq:AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is www.appliedmaterials.com. |
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