Applied Materials Announces New SEMVision G2 System for Sub-100nm In-line Defect Review and Classification.

Business Editors/High-Tech Writers

NOTE TO MEDIA: Multimedia assets available

SEMVision G2 Leapfrogs Market-Leading SEMVision Technology to

Enable Nanometer-Scale Chip Manufacturing

Applied Materials, Inc. today introduced its latest defect review system, the SEMVision(TM) G2, for nanometer-generation semiconductor manufacturing. The system extends the technology of the company's market-leading SEMVision system, which is currently used by virtually every major chipmaker worldwide, with advanced capability for rapidly imaging and analyzing defects as small as 80nm. Using proprietary imaging technology, the system can review defects at the bottom of high aspect ratio features as well as electrical defects, with high throughput of up to 1000 defects per hour with superb image quality.

"The SEMVision G2 defect review technology significantly increases our customers' ability to understand their defect issues and quickly find their root causes in the production environment," said Dr. Gilad Almogy, vice president and general manager of Applied Materials' Process Diagnostics and Control Division. "This new system solves the semiconductor industry's cost-sensitivity equation for its most advanced chips, with the highest throughput and greatest sensitivity to 80 nanometer-generation defects of all kinds. With its exceptional capabilities, the SEMVision G2 also helps put semiconductor manufacturers on the fast track to new technologies such as low k dielectrics and copper interconnects."

The technology engine of the SEMVision G2 system is its proprietary Multi-Perspective Imaging capability, which collects defect images from different angles and rapidly translates them into meaningful defect information. Key advances to the new system include improvements to the SEM column and detector which provide superb image quality under a wide variety of conditions. High aspect ratio imaging, incorporated in the column, allows high quality review of the bottom of 10:1 vias.

In addition to its highly automated defect review features, the SEMVision G2 provides advanced capabilities for both production and engineering. These include bare wafer review, patterned wafer EDX (energy-dispersive x-ray) and new process inspection capabilities. The system's Advanced Process Inspection (API(TM)) e-beam inspection mode allows users to choose critical areas of the die or predefined test structures for efficient inspection with high-resolution SEM (scanning electron microscope) imaging. The combination of superior voltage contrast imaging, API and test structure analysis enables customers to find both random and systematic killer defects, and quickly ramp-up new process modules.

The SEMVision G2 system has been shipping in volume since the first quarter of 2002, and multiple systems are installed at leading semiconductor fabs in the U.S., Europe and Asia. Since the first introduction of SEMVision technology in May 1998, Applied Materials has shipped over 200 systems to customers worldwide.

Applied Materials (Nasdaq:AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is http://www.appliedmaterials.com

Note: A Photo is available at URL: http://www.businesswire.com/cgi-bin/photo.cgi?pw.062602/bb2