Applied Materials Announces Major Breakthrough in HDP-CVD with Second-Generation System; Ultima HDP-CBD Centura Leads the Industry with First Production-Ready CVD System to Deliver Both Standard and Low k Oxide Films.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 25, 1996--Addressing the semiconductor industry's accelerating drive toward manufacturing technologies for 0.25-micron and below, high speed devices, Applied Materials launches its second-generation HDP-CVD (high density plasma chemical vapor deposition) system, the Ultima HDP-CVD Centura. Targeted for advanced intermetal dielectric (IMD) and critical shallow trench isolation (STI) applications, the Ultima delivers production-ready technology in a low cost-of-ownership design.

The Ultima system pioneers yet another Applied Materials advance in CVD technology by providing a common chamber to deposit standard HDP-CVD oxide film (called undoped silicate glass or USG) as well as "low k" fluorinated silicate glass (FSG). Low k oxides are critical for leading-edge device applications, enabling denser circuitry and higher computing speeds. Using the Ultima HDP-CVD Centura, customers can switch between process technologies with a simple recipe change and achieve the same exceptional film quality, high throughput and low operating cost.

"Production-worthy low k CVD technologies are crucial to our customers' advanced circuit designs. However, the industry's first-generation HDP-CVD systems are limited to standard oxide films and are expensive to operate due to high consumables cost," said Dr. Ashok Sinha, president of Applied Material's CVD Product Business Group. "The Ultima is the industry's first system to offer the advanced technology of USG and low k HDP-CVD in one chamber, while also providing the reliability and low cost of ownership of a second-generation product. In addition, we've introduced a revolutionary remote cleaning technology on this system that not only enables the low contamination levels required for STI applications, but dramatically cuts operating costs by eliminating chamber consumables and significantly extending system uptime."

"Applied Materials has been the global CVD market and technology leader for nearly a decade by effectively combining advanced technology with high-productivity manufacturing solutions. We've focused tremendous resources on the development and introduction of this second-generation HDP-CVD technology for mainstream production environments," said Dr. Farhad Moghadam, chief technical officer of Applied Materials' CVD Product Business Group. "The Ultima's high throughput and capital productivity set a new industry benchmark for HDP-CVD. Looking even further into the future, the system's planar source and chamber design include extendibility to ultra-low k (less than 2.5) films and scaling to 300mm wafers."

The Ultima is the most cost-effective HDP-CVD system on the market today. In a compact footprint, up to four Ultima HDP-CVD chambers can be fitted onto the company's production-proven Centura platform for a throughput of up to 70 wafers per hour. The process chamber uses no consumable parts, and its revolutionary remote plasma cleaning process requires no cover wafer to protect the electrostatic chuck. The Ultima is also the first totally "green" CVD system. Its highly efficient cleaning technology produces no global warming-causing emissions, thus eliminating the need for exhaust scrubbers.

"Applied Materials further strengthens its leadership position in the global CVD marketplace with this breakthrough HDP-CVD technology. We have already won advance orders for the Ultima from several key strategic accounts and are well-positioned to capture a major share of the rapidly growing market for high density plasma CVD," noted Dr. Sinha. "The Ultima is a key addition to our broad line of CVD products, which together meet customer requirements for mature, advanced and emerging technologies ranging through more than five device generations."

Ultima HDP-CVD systems began shipping in September 1996 to customers in the U.S. and Japan; additional commitments are in place for several multiple system orders as well. The company is now ramping up manufacturing capacity for the Ultima system, and full scale production is expected in the first calendar quarter of 1997.

Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market under the symbol "AMAT." Applied Materials' web site is http://www.AppliedMaterials.com

CONTACT: Applied Materials

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