Applied Materials Advances Transistor Silicide Technology with Applied Endura ALPS Ni PVD.Business Editors/High-Tech Writers SANTA CLARA, Calif.--(BUSINESS WIRE)--May 17, 2004 Applied Materials, Inc. (Nasdaq:AMAT AMAT Applied Materials (stock symbol) AMAT Average Memory Access Time AMAT Automatic Message Accounting Transmitter AMAT Anti-Materiel (bomb or mine) AMAT Ageing Management Assessment Team ) today introduced its Applied Endura(R) ALPS Alps, great mountain system of S central Europe, c.500 mi (800 km) long and c.100 mi (160 km) wide, curving in a great arc from the Riviera coast on the Mediterranean Sea, along the borders of N Italy and adjacent regions of SE France, Switzerland, SW Germany, and (R) Ni PVD PVD abbr. peripheral vascular disease PVD Peripheral vascular disease, see there system, the industry's most advanced gate silicide sil·i·cide n. A compound of silicon with another element or radical. Noun 1. silicide - any of various compounds of silicon with a more electropositive element or radical technology. The ALPS Ni (nickel) process provides customers with a 20-50% reduction in resistivity resistivity Electrical resistance of a conductor of unit cross-sectional area and unit length. The resistivity of a conductor depends on its composition and its temperature. at 40nm linewidths and a higher quality silicide than current materials -- meeting the critical requirements to enable 65nm and below transistor performance. Providing greater than 50% bottom coverage in 2.5:1 aspect ratio features with sub-100 angstrom angstrom (ăng`strəm), abbr. Å, unit of length equal to 10−10 meter (0.0000000001 meter); it is used to measure the wavelengths of visible light and of other forms of electromagnetic radiation, such as ultraviolet films, the ALPS Ni process delivers a low leakage interface with up to 2x reduction in silicon consumption compared to conventional silicide processes. "The Applied Endura ALPS Ni system takes PVD well into the 65nm generation and beyond for critical transistor applications with the reliability and flexibility customers require for high-volume production," said Dr. Fusen Chen, vice president and general manager of Applied Materials' Copper, PVD and Integrated Systems Group. "PVD is already the silicide process technology of choice for 130nm and 90nm devices, and it is becoming more important with each new generation as the simplest and most cost-effective solution." Applied Materials is the industry leader in gate silicide technology and the only company with PVD systems that support such a wide range of process technologies, from front-end, to interconnect and packaging applications. The ALPS Ni system is available for 200mm and 300mm wafer processing on both the Endura and recently introduced Endura2 platforms. The Endura2 features a new modular architecture that emphasizes reliability, serviceability and overall equipment efficiency for 300mm high-volume manufacturing. Multiple Applied Endura ALPS Ni systems have been shipped to customers in the U.S., Taiwan and Japan; additional systems are scheduled for shipment to customers in the U.S., Japan, China, Taiwan and S.E. Asia by the end of 2004. Applied Materials, Inc. (Nasdaq:AMAT) is the largest supplier of equipment and services to the global semiconductor industry. Applied Materials' web site is www.appliedmaterials.com. *PVD: physical vapor deposition  This article or section is in need of attention from an expert on the subject.Please help recruit one or [ improve this article] yourself. See the talk page for details. |
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