Applied Materials Advances Low k Dielectric Etch Technology for Copper Dual Damascene Applications.

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SANTA CLARA, Calif.--(BUSINESS WIRE)--March 19, 2002

eMax(TM) EnTek(TM) System Offers "Intact k-Value"

Performance, Productivity and Cost Advantages

Applied Materials, Inc. is extending dual damascene etch processing capability with the Dielectric Etch eMax(TM) EnTek(TM) Centura(R) system that provides an enabling, cost-effective solution for etching low k dielectric materials in high performance copper chips. The system's proprietary Deposition Mode(TM) and Clean Mode(TM) technologies seamlessly integrate and optimize etch, photoresist strip and barrier removal process steps on a single system to preserve the integrity of the k-value and critical dimensions while reducing cycle time by an order of magnitude over traditional process flows.

"Building on the production-proven capabilities of the successful eMax system, the EnTek offers an all-in-one system etch solution that lowers cost of ownership for volume production," said Dr. Diana Ma, vice president and general manager of Applied Materials' Dielectric Etch Division. "We have incorporated our extensive experience in etching damascene materials, including low k films, in the eMax EnTek to provide a robust, high-yield etch process that we believe meets our customers' most demanding requirements. Already, customers have demonstrated that the eMax EnTek provides robust process performance with lower variability in wafer-to-wafer damascene trench depth etching than any competitive system."

A major challenge for integrating low k materials is maintaining the integrity of the dielectric material during post-etch strip. By separating deposition (via and trench etch, polymer-rich processes) and clean (photoresist and barrier removal, polymer-free processes) steps, the eMax EnTek preserves material properties, minimizing changes to the k value of the dielectric film associated with post-etch strip processing. This approach also eliminates the productivity impact incurred by competitive single-chamber solutions that require more extended cleans.

The unique design of the eMax chamber provides for a soft, stable and uniform barrier removal process that improves cleanliness and enhances yield performance. New, advanced iRM(TM) (integrated rate monitor) sensor technology provides precise control of trench etch depth. This capability also minimizes wafer-to-wafer electrical performance variation and eliminates the need for a middle stop layer that reduces the effective k value of the film layers. The eMax EnTek system's iRM technology will be the focus of a technical article being published in the April issue of Solid State Technology.

According to Dataquest, a market research firm, the dielectric etch market is estimated to total $1.2 billion in 2001, growing to over $2.4 billion by 2005.

Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the NASDAQ National Market System under the symbol "AMAT." Applied Materials' web site is www.appliedmaterials.com.

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