Printer Friendly

Applied Materials Achieves CVD Leadership for 17th Year.

SANTA CLARA, Calif. -- Applied Materials, Inc. increased its market share in reactor-type CVD (chemical vapor deposition) systems in 2004 to 58% of the estimated $3.0 billion market, according to Gartner Dataquest's April 2005 report(1). Calendar year 2004 was the 17th consecutive year that Applied Materials was named the industry leader in CVD. The company offers leading dielectric and metal CVD technologies for virtually every application within the CVD market, including transistor, capacitor and interconnect fabrication for both memory and logic chips.

"Applied Materials' continued success in helping chipmakers around the world implement a wide range of CVD films for copper interconnects, including our Black Diamond(R) low k dielectric and other advanced films, resulted in high demand for our systems," said Dr. Farhad Moghadam, senior vice president and general manager of Applied Materials' Thin Films Product Business Group. "Our transistor-level CVD technologies also provided DRAM customers with gap-fill and lithography-enabling films to help extend memory technology. Applied's breakthrough strain-engineered solutions are currently being designed into many advanced chips to increase speed and reduce power consumption."

Applied's primary CVD platform is its award-winning Producer(R) CVD system, which provides the industry's broadest array of plasma and thermal CVD processes. By early 2005, customers had purchased over 1,000 Producer CVD systems. A key Producer application is Applied's Black Diamond(R) film, the industry's most widely-used low k dielectric material. The implementation of Black Diamond has increased steadily year after year as key chipmakers expand their low k-based products and transition to 90nm and 65nm copper interconnect designs. The Applied Centura(R) Ultima HDP-CVD(2) system also made significant gains as the leading HDP-CVD system for pre-metal dielectric and STI(2) gap-fill applications.

Chipmakers are increasing their use of Applied's strained silicon solutions in their process flows to increase transistor performance in 90nm and 65nm-generation designs. The Applied Producer HARP(TM) process and Applied's innovative strain-engineered Stress Nitride films together have demonstrated greater than 30% transistor speed improvement -- without added integration complexity or cost.

Forward-Looking Statements. This press release contains forward looking statements, including those related to Applied Materials' technological leadership, product capabilities, strategic position and opportunities. These statements are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements, including but not limited to: the sustainability of demand in the semiconductor and semiconductor equipment industries, which is subject to many factors, including global economic conditions, business spending, consumer confidence, demand for electronic products and semiconductors, and geopolitical uncertainties; the timing, rate, amount and sustainability of capital spending for new technology, such as 300mm and sub-100 nanometer applications; the company's ability to successfully develop, deliver and support a broad range of products and services and expand its markets; and other risks described in Applied Materials' Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management's estimates, projections and assumptions as of the date hereof and the company undertakes no obligation to update any forward-looking statement.

Applied Materials, Inc. (Nasdaq:AMAT), headquartered in Santa Clara, California, is the largest supplier of equipment and services to the global semiconductor industry. Applied Materials' web site is www.appliedmaterials.com.
(1) "Wafer Fab Equipment Market Share Reshuffled in Boom of 2004,"
 Dean Freeman, Mark Stromberg, Klaus Rinnen, Bob Johnson, Takashi
 Ogawa; Gartner Dataquest Report April 1, 2005.

(2) HDP-CVD = high-density plasma chemical vapor deposition
 STI = shallow trench isolation
COPYRIGHT 2005 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2005, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Jun 1, 2005
Words:570
Previous Article:Vignette Recognized by Software & Information Industry Association as Industry's Best Document Management Solution; Vignette Records & Documents...
Next Article:China Media1 Corp.: Sunkist Soft Drinks of China to Advertise on Guangzhou Subway System.
Topics:


Related Articles
Applied Materials Announces Next-Generation CVD Gap-Fill Technology; Centura HDP-CVD Provides Production-Ready Precision Gap Fill for 0.25 micron...
Applied Materials Announces Major Breakthrough in HDP-CVD with Second-Generation System; Ultima HDP-CBD Centura Leads the Industry with First...
Applied Materials Sets Industry Milestone with 5,000th Multi-Chamber System; Single-Wafer, Multi-Chamber Systems Have Dramatically Changed the Way...
Applied Materials Ships 100th Ultima HDP-CVD Centura System to Toshiba; Market Leading HDP-CVD System Now Used by 17 of Top 20 Chipmakers.
ALTIS SEMICONDUCTORS AND NOVA TO IMPLEMENT PROCESS CONTROL INFRASTRUCTURE.
Applied Materials Awarded Two Additional Patents for Low k Dielectric Technology.
Applied Materials Named World's Number One Supplier of HDP-CVD Systems for the Fourth Consecutive Year.
Applied Materials Ships Milestone 500th Producer CVD System; High-Productivity Producer System Has Been Shipped to all Major Chip Manufacturers.
Applied Materials Achieves Milestone Shipment of 1,000th Producer CVD System.
Applied Materials Achieves Milestone 1,000th HDP-CVD System Shipment.

Terms of use | Copyright © 2014 Farlex, Inc. | Feedback | For webmasters