Applied Materials' New NanoSEM 3D Metrology System Enables 193nm Lithography Control.Business Editors/High-Tech Writers NOTE TO MEDIA: Photo is available in a Smart News Release(TM) on Business Wire's Home Page at www.businesswire.com and at www.newstream.com SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif.--(BUSINESS WIRE)--Feb. 28, 2002 Advances in Automatic 3D Imaging Provide Industry with Unique In-Line Metrology Solution for High-Yield Sub-100 Nanometer Chip Production Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar , Inc. (Nasdaq:AMAT AMAT Applied Materials (stock symbol) AMAT Average Memory Access Time AMAT Automatic Message Accounting Transmitter AMAT Anti-Materiel (bomb or mine) AMAT Ageing Management Assessment Team ) announces its NanoSEM 3D(TM) system, the industry's only fully-automated 3D CD-SEM/a that enables chipmakers to precisely control 193nm-wavelength lithography and advanced etch processes for 100nm-generation and below chip manufacturing. The NanoSEM system's unique imaging technology allows customers to automatically view and measure both the top and sides of chip features and rapidly capture excursions invisible to conventional top-view CD metrology tools. "The NanoSEM 3D system is the industry's only product that solves the critical metrology hurdles facing 193nm lithography and etching, namely decreasing depth of focus and photoresist shrinkage, while providing full automation for the production fab environment," said Dr. Gilad Almogy, vice president of Applied Materials' Process, Diagnostics and Control Division. "Using this system to detect slope problems very quickly after processing, chipmakers can control their lithography and etch processes before they lead to major yield losses. The NanoSEM 3D system is the industry's first sub-100nm-generation CD-SEM CD-SEM Critical Dimension - Scanning Electron Microscopy system that chipmakers can use as their primary in-line metrology tool for profile analysis." Decreasing depth of focus, a key challenge for 193nm lithography, creates sidewall side·wall n. 1. A wall that forms the side of something. 2. A side surface of an automobile tire, between the edge of the tread and the wheel rim. Noun 1. slope angle variations in chip features that cannot be automatically monitored using existing CD-SEM metrology tools. With the NanoSEM 3D system's broad range of multi-directional electron beam tilt angles, customers can automatically monitor the slope angles of critical features on every wafer. NanoSEM 3D technology is optimized to provide minimal photoresist shrinkage during measurement -- another important 193nm lithography parameter. Customer benchmark tests showed superior photoresist performance and excellent image quality. The NanoSEM 3D system also enables advanced etch processes such as shallow trench isolation Shallow trench isolation (STI) is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. (STI STI systolic time intervals. ), gate and dual damascene applications by providing fast, in-line measurement and control of trench and via depth. By helping define and control the lithography and etch process window, the NanoSEM 3D system lets users automatically monitor critical parameters such as stepper step·per n. 1. One that steps, especially in a fast or spirited manner. 2. Informal A dancer. Noun 1. focus and etch depth, contributing to increased device yield and fab profitability. Advanced pattern recognition algorithms enhance navigational accuracy, increasing fab productivity by shortening the time to accurately reach the measurement site, for increased throughput and superior measurement reliability. Production shipments of the NanoSEM 3D system are scheduled to begin in the first calendar quarter of 2002. Multiple systems have already been installed in customer fabs, including foundries and manufacturers of DRAM and logic devices. Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol "AMAT." Applied Materials' web site is www.appliedmaterials.com. /a 3D CD-SEM = Three dimensional critical dimension scanning electron microscope scan·ning electron microscope n. Abbr. SEM An electron microscope that forms a three-dimensional image on a cathode-ray tube by moving a beam of focused electrons across an object and reading both the electrons scattered by the object and Note: A Photo is available at URL URL in full Uniform Resource Locator Address of a resource on the Internet. The resource can be any type of file stored on a server, such as a Web page, a text file, a graphics file, or an application program. : http://www.businesswire.com/cgi-bin/photo.cgi?pw.022802/bb1 |
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