Applied Chemical Laboratories Introduces a Non-Corrosive, BEOL Post Etch Residue Remover for sub-90 nm Semiconductor Manufacturing.

Fast Acting ACL-585 HiPER-Solv(TM) Replaces Hydroxylamine, and Fluoride-Containing Products, Works 2-3 Times Faster and Reduces Total Cost of Ownership by 40%

SUNNYVALE, Calif. -- Semiconductor chip manufacturers now can realize significant improvement in removal of post-etch hardened polymers and polymer residue from metal and via etch processes. The breakthrough is achieved through the use of a new non-corrosive, environmentally benign post-etch residue remover developed by Applied Chemical Laboratories, Inc. ACL-585 HiPER-Solv(TM) (patents pending) is a high performance etch residue solvent that provides reduced cost of ownership, superior performance, and prevents corrosion when compared with conventional hydroxylamine or solvent-amine products. ACL-585 is specifically formulated for advanced sub-90 nm design rules that incorporate high density plasma etch.

ACL-585 HiPER-Solv outperforms conventional removers in several ways. HiPER-Solv dissolves hard to remove inorganic or organo-metallic polymers from post-metal and post-via etch layers 2 to 3 times faster than conventional removers. Cleaning time, for example, is reduced to 5 to 10 minutes compared with 20 to 40 minutes required by standard polymer removal recipes. In addition, ACL-585 works at a lower temperature (35[deg]C to 65[deg]C) compared with traditional HA and solvent-amine formulations that require process temperatures from 65[deg]C to 80[deg]C. ACL-585's forgiving characteristics enable engineers to design and operate in a larger process window without sacrificing device performance.

ACL-585 is designed for single wafer, batch immersion, and batch spray tool applications. Capable of dissolving 248nm and 193nm resin systems, HiPER-Solv also functions as an effective bulk photoresist stripper. Advanced DUV resists and ARCs have enabled etch engineers to achieve ultra-fine geometries, and passivation polymers control corrosion and minimize sidewall roughness. However, these inorganic polymers can be difficult to remove without damage to the underlying films. Furthermore, conventional polymer removers require a quenching, post-strip rinse in order to minimize water induced corrosion and collateral film loss. HiPER-Solv requires only a DI water rinse, so secondary solvents such as IPA or proprietary neutralization products are not required.

ACL-585 is 100% water soluble and non-flammable, plus it is free from ethylene glycols, ammonium fluoride, HF, NMP, DMSO, and hydroxylamine. With the spotlight increasingly on "green manufacturing" practices, semiconductor fabs are looking for less harmful and safer materials to replace hazardous chemicals. ACL-585 combines ease-of-use and extended product life with an improved environmental profile that minimize EHS exposure and liability. NFPA Hazard Code is H=2 F=1 R=0

A significant attribute of ACL-585 is that it bridges the aluminum-to-copper transition. This unique feature enables HiPER-Solv to readily clean polymers from aluminum and copper devices without causing corrosion. With an etch rate of less than 1A/min for both copper and aluminum and being virtually inert to ultra low-k dielectric films, ACL-585 eliminates redundant chemical distribution systems and facilitates multiple integration schemes.

ACL-585 provides significant cost savings in several ways over hydroxylamine removers. Owing to its exceptionally stable bath life, efficacy of ACL-585 is maintained 2 to 3 times longer than that of hydroxylamine removers. And, since it works at a much lower temperature, there is less evaporative loss, tool ramp time is faster, and productivity is improved. ACL-585 also eliminates costly disposal of segregated solvent waste streams associated with the use of hydroxylamine and fluorinated compounds. Lastly, requiring only a DI water rinse, ACL-585 eliminates the cost, handling and disposal of post-strip rinse solutions or IPA. Combined net impact to the fab is cost savings of up to 40% compared with traditional remover chemistry.

ACLI products are supplied in certified, low particulate, low metal specialty containers from Applied Chemical. Availability is immediate. Contact factory for applications support, samples and volume pricing.

About Applied Chemical Laboratories, Inc.

Applied Chemical Laboratories, Inc. is a privately held specialty chemical supplier located in Sunnyvale, CA. ACLI manufactures and markets advanced BEOL cleaning chemicals, and custom dielectric films for STI and gap fill applications. ACLI founders are industry veterans with numerous patents and technical papers in the field of BEOL cleaning, and critical electronic materials. Learn more at www.appchem.com