Apogee Exhibits Sensilica(TM) Miniature Pressure Sensors at Exhibition; New Family of All-Silicon Sensors with Size, Cost, Performance and Reliability Advantages.

NORWOOD, Mass. -- Apogee Technology, Inc. (AMEX:ATA), an emerging Micro-Electromechanical Systems ("MEMS") device supplier, announced today that it will be exhibiting its family of "all silicon" Sensilica(TM) pressure sensors at the SensorsGov Expo and Conference, in booth number 109 from December 6-9, 2005. Apogee will be displaying a wide range of miniature Sensilica pressure die suitable for absolute pressure measurement applications from 15 to 1000 PSI as well as specialized applications that can take advantage of the device's extremely small size. In addition to the Sensilica offerings, Apogee will be displaying its emerging micro sensor technologies for gas and biological sensing and its MEMS-based medical products.

Apogee will display nine new Sensilica pressure die products including the ATA0015A for low pressure applications, the ATA0045A/0060A/0100A for medium pressure applications and the ATA0200A/0300A/0500A/0750A/1000A targeted for high pressure applications. Apogee believes that the key advantages of Sensilica sensors are derived from the novel manufacturing approach and design methodology that reduces sensor size by a factor of four to eight when compared with traditional pressure sensor solutions. Apogee believes that this simplified "all silicon" approach will significantly reduce cost and improve reliability by eliminating the need to use multiple components to create a pressure sensor. In addition to the size and cost benefits of this solution, Apogee expects Sensilica sensors to be very robust, thus significantly reducing the potential of failure when the sensor is subjected to excessive pressure levels.

"Our goal in developing these sensors is to provide the smallest lowest cost pressure sensor for a range of measurement applications," said John O'Brien, Apogee's Sensor Product Manager. "By adopting a common device footprint for all Sensilica designs, our customers can use the same packaging and manufacturing tooling to produce sensors or transducer products across a wide pressure range. The very small die size which is less than 0.8 by 0.8 by 0.4 millimeters thick, will enable very small low profile package solutions for demanding applications such as aerospace where size is critical."

Sensilica pressure die samples and pricing can be obtained by contacting John O'Brien at [phone]. Additional information about Sensilica products can be found on the Company's website at www.apogeemems.com.

About Apogee Technology, Inc.

Apogee Technology designs, develops and markets proprietary products using its Micro-Electromechanical Systems ("MEMS") technologies for an intended use in the automotive, industrial, consumer and medical markets. The Company has developed a family of pressures sensors, under the Sensilica(TM) brand and is currently developing a MEMS based medical device for enhanced drug delivery. The Company operates a worldwide marketing and sales organization and has offices in the US, Hong Kong and Japan. For more information please visit our web site at: http://www.apogeemems.com.

Sensilica(TM) is a trademark of Apogee Technology, Inc. All other product names noted herein may be trademarks of their respective holders. Certain statements made herein that use the words "anticipate," "hope," "estimate," "project," "intend," "plan," "expect," "believe" and similar expressions are intended to identify forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements involve known and unknown risks and uncertainties, which could cause the actual results, performance or achievements of the company to be materially different from those that may be expressed or implied. Please refer to the company's risk factors as set forth in the company's filings with the Securities and Exchange Commission, including its reports on Forms 10-KSB and 10-QSB.