Apache Design Solutions to Present at ISLPED 2007, a Session on Low Power Analysis and Verification.MOUNTAIN VIEW, Calif. -- Apache Apache (əpăch`ē), Native North Americans of the Southwest composed of six culturally related groups. They speak a language that has various dialects and belongs to the Athabascan branch of the Nadene linguistic stock (see Native American Design Solutions, the leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC) designs, today announced that the company will present a technical paper on methodology for analysis and verification of power-gated circuits and designs at the ISLPED ISLPED International Symposium on Low Power Electronics and Design (International Symposium symposium In ancient Greece, an aristocratic banquet at which men met to discuss philosophical and political issues and recite poetry. It began as a warrior feast. Rooms were designed specifically for the proceedings. on Low Power Electronics and Design) 2007, being held August 27 - 29, 2007 in Portland, Oregon. For more information please visit www.ispled.org.
WHO: Apache Design Solutions, Inc.
WHAT: Technical Paper: "A methodology for analysis and
verification of power gated circuits and designs with
correlated results", presented by Kai Wang of Apache
Design Solutions.
WHERE: ISLPED 2007, Embassy Suites, 319 S.W. Pine Street,
Portland, Oregon.
WHEN: Wednesday, August 29, 2007 - 11:15 AM - 12:45 PM
About Apache Design Solutions Apache delivers the leading power sign-off solution adopted by 80% of top IDMs, fabless semiconductor companies A fabless semiconductor company specializes in the design and sale of hardware devices implemented on semiconductor chips. It achieves an advantage by outsourcing the fabrication of the devices to a specialized semiconductor manufacturer called a semiconductor foundry or "fab. , and foundries, as well as complete platform solutions for silicon integrity of SoC, analog-IP, and system designs. Apache's innovative platform considers all sources of noise that impact the design--such as power, signal, package / system I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output , substrate The base layer of a structure such as a chip, multichip module (MCM), printed circuit board or disk platter. Silicon is the most widely used substrate for chips. Fiberglass (FR4) is mostly used for printed circuit boards, and ceramic is used for MCMs. , and temperature--Apache's silicon integrity platform enables designers of leading networking, wireless, communication, consumer, and semiconductor companies to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon / system. Apache's vendor-neutral solutions enable designers to adopt any industry-standard physical design flow and are in production use by over 40 customers worldwide. For more information, visit www.apache-da.com. |
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