Apache Design Solutions to Participate in Three DesignCon Sessions Addressing Chip-Package-System Co-Design.

SAN JOSE, Calif. -- Apache Design Solutions, the technology leader in power and noise integrity for chip, package, and system convergence, today announced that they will be participating in several technical and business conference sessions at the upcoming DesignCon Conference held in Santa Clara, California. Apache's key executives will be discussing the latest challenges and solutions in maintaining power, noise, and thermal integrity and driving convergence across IC, package, system, and SiP designers.

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This paper demonstrates an optimum methodology to capture the worst-case switching activity when performing the power integrity analysis for the core power of ASIC.

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This panel will discuss the challenges faced by IC and system designers on reaping the benefits of SiP technology and what foundries and package providers are doing to make SiP a reality.

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This panel will discuss the challenges faced by the IC and package teams as power, SI, reliability, thermal, stress, etc. issues further exacerbates design and validation of multi-die chips, and the solutions needed to address these challenges.

Apache will also be exhibiting at DesignCon in booth #514, demonstrating the industry's leading power, noise, and reliability platform solutions for Chip-Package-System co-design. Attendees will learn how to mitigate the design risks induced by noise issues, reduce overall cost, and improve productivity and time-to-market.

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Apache Design Solutions at DesignCon 2009
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Santa Clara Convention Center, Booth #514
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Santa Clara, California
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February 3 - 4, 2009
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12:30PM - 6:30PM PST

For more information visit: www.designcon.com

About Apache Design Solutions

Apache delivers the industry's leading power and noise analyses solutions from early-stage to signoff for chip, package, and system designs. Apache's innovative platforms considers multiple noise sources that impact the design--such as power, signal, package / system IO, substrate, and temperature--and enables engineers to optimize and validate their designs. Certified by TSMC and Common Platform Reference Flows, Apache's products are adopted by 80% of the top IDM, fabless semiconductor, and foundries for risk mitigation, cost reduction, and time-to-market improvements. Apache is a global company with R&D centers and direct sales / support offices worldwide. For more information, visit www.apache-da.com.

Apache Design Solutions, NSPICE, RedHawk, PakSI-E, PsiWinder, Sahara, Sentinel, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.