Ansoft Releases Turbo Package Analyzer-TM, Version 4.0.

Business Editors & High Tech Writers

PITTSBURGH--(BUSINESS WIRE)--Feb. 25, 2002

Ansoft Corporation (Nasdaq:ANST)

Innovative Technology Speeds Time-to-Market of

Complex Flip-Chip Packages Used in Optical Communications,

High-End Graphics, and Computing

Ansoft Corporation (Nasdaq:ANST) today announced the release of Turbo Package Analyzer (TPA) 4.0, an advanced software tool that automates the analysis of all complex semiconductor packages.

The new version of TPA, which can analyze flip-chip, chip-scale package, and multiple-die system-in-package designs common in the networking and broadband communications markets, includes an industry-first, multipole-accelerated Partial Element Equivalent Circuit (multi-PEEC) engine and an advanced model reduction algorithm for ultra-fast simulations of high-speed traces.

Using distributed circuits for greater accuracy, the multi-PEEC engine allows engineers to model long traces carrying high-speed signals. The model reduction algorithm simplifies the distributed circuits by orders of magnitude to speed subsequent time-domain simulation in SPICE.

"Our beta test period for TPA 4.0 has been very successful," said Jonathan Smith, Ansoft's Product Marketing Manager, Signal Integrity Products. "The list of beta customers included such well-known companies as Amkor, Micron, Nvidia, AMCC, ChipPAC, Agere Systems, Motorola, and VLSI/Philips, and we thank them for their contributions to our software-release process."

TPA fully characterizes an entire package structure and automatically produces accurate lumped or distributed RLC (Resistance, Inductance, and Capacitance) values for any trace or coupled groups of traces. Providing designers with a seamless workflow, the software generates RLC models directly from leading package layout tools, such as Cadence(R) Advanced Package Designer(TM) (APD), Avanti Encore(TM) IC Package Designer, and Zuken's CR-5000(TM) advanced packaging solution.

The new version automates cross-talk analysis for any type of BGA package structure, including wire bonds, pads, vias, tapered traces, solder balls, and non-ideal power and ground structures. The user simply specifies the number of adjacent or nearby traces for coupling, and TPA automatically calculates all of the coupling values.

About Ansoft

Ansoft is a leading developer of high-performance EDA software. Engineers use Ansoft software to design state-of-the-art electronic products, such as cellular phones, Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs), automotive electronic systems, and power electronics. Ansoft markets its products worldwide through its own direct sales force and has comprehensive customer-support and training offices throughout North America, Asia, and Europe. For more information, please visit www.ansoft.com.