Ansoft Releases TPA v4.2 with Seamless Integration to Synopsys' Encore; IC Package Designers Accurately Characterize Designs with Full Parasitic Extraction.

PITTSBURGH -- Ansoft Corporation (NASDAQ:ANST) announces Turbo Package Analyzer(TM) (TPA) v4.2. This latest version combines new bidirectional integration with Synopsys' Encore(TM) package-design software with Ansoft's state-of-the-art 3D electromagnetic simulation. It enables full parasitic extraction of complex IC packages, such as ball-grid arrays (BGAs).

"As a result of our close collaboration, Ansoft's advanced electromagnetic technology for package extraction and characterization can be accessed directly from our Encore product today," said Kevin Rinebold, Synopsys' senior technical marketing manager, Packaging Products. "Our work with Ansoft further advances the state of the art in package planning and design by integrating Ansoft's latest capabilities with our IC/Package co-design environment."

With AnsoftLinks(TM), a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools. It accepts CAD data and fully characterizes the entire package in three dimensions. The 3D analysis provided by the TPA v4.2 extraction engine can solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls and non-ideal power and ground structures.

For crosstalk simulations, TPA v4.2 automatically provides a multi-conductor coupled RLC model for each lead in the package. The user specifies the number of nearby (adjacent) leads for coupling, and the program automatically calculates all of the parasitics.

TPA highlights include:

   --  RLC extraction via 3D field solvers
       --  Ansoft's state-of-the-art 3D field-solver technology
       --  Fast Multipole Method for lumped parasitics
   --  Full package extraction via automatic partitioning
       --  Automatic partitioning via coupling length
       --  Power and ground plane inclusion
       --  Robust and automatic meshing
   --  Critical net analysis
   --  Seamless integration of TPA within Synopsys Encore
       --  Including bondwires and solder balls
       --  File export in Synopsys SNPS and SPEF formats
   --  Outputs RLC, SPICE, IBIS .pkg
   --  Package layout support through AnsoftLinks(TM) for Cadence and
        Zuken

Pricing and Availability:

TPA v4.2 is available for Windows(R) and SUN/Solaris. Contact your nearest Ansoft sales office for pricing information.

To download a high-resolution image, please go to ftp://ftp.ansoft.com/techsup/download/web/primg/tpa42.tif.

About Ansoft

Ansoft is a leading developer of high-performance electronic design automation (EDA) software. Engineers use Ansoft software to design state-of-the-art electronic products, such as cellular phones, Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs), automotive electronic systems and power electronics. Ansoft markets its products worldwide through its own direct sales force and has comprehensive customer-support and training offices throughout North America, Asia and Europe. To learn more, please visit www.ansoft.com.