An Analysis of the FPS Market Including for Example Market Size / Predictions, and the Largest Companies.

DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c27873 ) has announced the addition of FPC Report to their offering

Market Sizes and Forecasts of FPC/Tape Substrates

Production Trends of Two-Layer and Three-Layer Type (Single-Sided/Double-Sided/Multilayer)

Largest FPC Manufacturers in 2004

Market Trends by Application Fields (Mobile Phones/HDD/Camera Modules/Displays/Automobiles/ Audiovisuals/PC/others)

Topics Covered

Section 1, Introduction

Premise: Classification of FPC

1. Market trend

(1) Overall market trend

(2) Market size estimation by product type

2. Size of business for major companies -2004

3. Trend of the FPC

3.1 Trend of major applications

3.1.1 Market size estimation by application

3.1.2 Cellular phone

3.1.3 Hard Disk Drive (HDD)

3.1.4 Camera module

3.1.5 Printer

3.2 Price trend for FPC

(1) Price trend by product type

(2) Price trend by application

3.3 Major companies' status

(1) Production status

(2) Trend for base film

(3) Trend for copper foil

Section 2, Market trend

I. FPC market

1. Market size for FPC

(1) Market size breakdown by SS/DS/multi-layer

(2) Trend of SS and DS FPC by FCCL type

(3) Trend of multi-layer FPC by product type

(4) Trend of multi-layer FPC (all PI type) by layer count

(5) Breakdown by application

2. Major companies' status

(1) Overall

(2) SS/DS/multi-layer

1. In amount

2. In volume

(3) Single sided FPC

(4) Double sided FPC

(5) Multi-layer FPC (All PI type)

(6) Market share by application

3. Market size forecast for FPC

(1) Breakdown by SS/DS/multi-layer

(2) Market size for SS and DS FPC by FCCL type

(3) Market size for multi-layer FPC by product type

(4) Market size of all PI type multi-layer FPC by layer count

(5) Market size by application

II. COF market

1. Market size for COF

(1) Market size for COF

(2) Market size for COF, TCP and T-CSP&BGA 

(3) Market breakdown of COF, TCP, T-CSP&BGA by application

(4) Market size by type and application -2004 -

(5) Market size by type and application

1. In volume

2. In amount

2. Status of COF manufacturer

(1) Overall market trend for 2004

(2) Market share by type for 2004

(3) Market share by application for 2004

(4) Market share of COF/TCP/T- CSP & BGA 2004

3. Market size forecast for COF

(1) Overall market size forecast

(2) Forecast for COF, TCP and T- CSP&BGA

(3) Forecast for COF, TCP and T- CSP&BGA by application

(4) Detailed forecast for COF, TCP and T-CSP by application

1. In volume

2. In amount

Section 3, Case study for major companies

I. FPC manufacturer

Companies Mentioned

Nippon Mektron CO., Ltd. - SUMITOMO ELECTRIC INDUSTRIES , LTD. - NITTO DENKO  COPORATION - AKITA SUMITOMO BAKELITE Co Ltd. - Hitachi Chemical Company - Toyobo Co., Ltd. - INTERFLEX CO., LTD. - YOUNG POONG Electronics Co., Ltd. - SANYANG Electro Mechanics Co. Ltd - SIFLEX Co., Ltd - NEWFLEX LTD - Career Technology (MFG) Co., Ltd. - 3M Company - Multi-Fineline Electronix, Inc. - Innovex Inc. - Parlex Corporation - II. COF manufacturer - MITSUI MINING & SMELTING CO., LTD. - SHINDO COMPANY - CASIO MICRONICS CO., LTD - HITACHI CABLE  LTD - STEMCO CO., LTD - SAMSUNG TECHWIN CO., LTD - LG MICRON CO., LTD

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