Amkor to Commence Wafer Bumping in Singapore.

CHANDLER, Ariz. -- Amkor Technology, Inc. (NASDAQ:AMKR) today announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan. Amkor's Singapore bump facility is expected to commence operations in the second half of 2006 and will provide, in conjunction with Amkor's existing test operations in Singapore, wafer bump and wafer probe services to support emerging applications on 300 mm wafers at the 90 nm and 65 nm process nodes. Amkor Singapore will offer a full suite of its 300 mm wafer bumping services on a "copy exact" basis with Amkor's existing bumping operation in Taiwan.

"We are taking this step in close collaboration with Singapore's Economic Development Board, Chartered Semiconductor Manufacturing, and other customers who operate in Singapore," said Oleg Khaykin, Amkor's Chief Operating Officer. "As wafer process technology continues to advance below 90 nanometers, IC packaging will increasingly require advanced flip chip and wafer level solutions. This collaboration will complement our existing flip chip capabilities and enhance Amkor's position as the industry's leading provider of turnkey flip chip assembly and test services. Singapore's excellent infrastructure and strong semiconductor manufacturing base were key considerations for Amkor."

"Our production build-out is largely supported by long-term supply agreements for both bump and probe services," said Khaykin. "Our capital contribution toward developing the first phase of this facility is included in our previously announced, preliminary capital expenditure budget for 2006."

"This initiative builds on our Unitive acquisitions and strategic alliance with IBM, and it is designed to help support the growing adoption of flip chip packaging for silicon using IBM and other process technologies in Singapore," said Khaykin. "The strong interest and support we have received for this initiative further underscores the value that Amkor's foundry partners and customers place in our wafer bumping technology and our ability to provide turnkey flip chip services."

"We are grateful for Amkor's confidence in Singapore. In less than 2 years after establishing its presence here, Amkor is establishing a new wafer bumping operation and pledging to increase its investments in Singapore," said Mr Teo Ming Kian, Chairman of the Singapore Economic Development Board. "Wafer bumping is a key enabling process in the manufacture of chip size packages used in many consumer electronic devices. Amkor's new wafer bumping plant here will help grow this key capability, thereby increasing Singapore's competitiveness in providing complete semiconductor manufacturing solutions."

"Amkor's choice of Singapore for its advanced bumping capabilities, in close proximity to Chartered's manufacturing facilities, is extremely beneficial to our mutual customers," said Mr Chia Song Hwee, President and CEO of Chartered. "The direct benefits are faster post-fab cycle time, better coordination for quality and overall manufacturing efficiencies. Our enhanced collaboration will result in improved synergy and seamless technology integration and coordination for the benefit of customers."

"Since 2004 Amkor has invested nearly $80 million in our Singapore operations, and over the next several years we anticipate our total investment in Singapore will approach $200 million," said Amkor's Oleg Khaykin. "We expect this new bump facility to generate several hundred high value jobs over the next 18 months. We are encouraged by Singapore's rich pool of advanced engineering talent and we envision drawing upon that pool to enhance and extend our R&D capabilities."

About Amkor

Amkor is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and, manufacturing and support services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

Forward-Looking Statement Disclaimer

This press release contains forward-looking statements within the meaning of federal securities laws, including, without limitation, statements regarding growing adoption of flip-chip packaging; long-term supply agreements for both bump and probe services; anticipated investments in Singapore over the next several years; and anticipated job creation over the next 18 months. These forward-looking statements are subject to a number of risks and uncertainties that could affect future results and cause actual results and events to differ materially from historical and expected results, including, but not limited to, the following: the highly unpredictable nature of the semiconductor industry; volatility of consumer demand for products incorporating our semiconductor packages; economic and political events in Singapore; weakness in the forecasts of Amkor's customers; customer modification of and follow through with respect to forecasts provided to Amkor; deterioration of the U.S. or other economies; the highly unpredictable nature of litigation and the risk of adverse results of litigation against us; our relationship with IBM; the satisfaction of conditions in the agreements entered into in connection with the IBM transaction; the incurrence of significant additional cost and expense necessary for the increase in Amkor's capacity; worldwide economic effects of terrorist attacks and military conflict; competitive pricing and declines in average selling prices; timing and volume of orders relative to the production capacity; fluctuations in manufacturing yields; competition; dependence on international operations and sales; dependence on raw material and equipment suppliers; exchange rate fluctuations; dependence on key personnel; the effect on operations of our realignment of management; difficulties in managing growth; enforcement of intellectual property rights; environmental regulations and technological challenges.

Further information on risk factors that could affect the outcome of the events set forth in these statements and that could affect the company's operating results and financial condition is detailed in the company's filings with the Securities and Exchange Commission, including the Report on Form 10-K/A for the year ended December 31, 2004 and Form 10-Q for the quarter ended September 30, 2005.