Amkor is Expanding LGA Package Offerings; Demand Increasing for Thinner Chip Scale Packaging.Business Editors/High-Tech Writers CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 7, 2000 A new high-technology family of thinner, lighter, lower cost, more reliable and lead-free packages called land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. is opening new business opportunities for Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, (Nasdaq: AMKR AMKR Amkor Technology ) as original equipment manufacturers (OEMs) search for new packaging options for portable devices. Amkor announced today that it is expanding efforts to make its land grid array (LGA LGA abbr. large for gestational age LGA Large for gestational age, see there ) option available across a wide range of its product lines. Amkor's unique LGA packages now are available using leadframe, laminate and tape substrates, giving a greater range of options for end-use products. LGA packages are connected to device boards through thin, flat lands that provide greater contact strength in portable products that are often subject to abuse in handling. The company has optimized the LGA form factor through board-level testing in-house and with major OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and customers. Since the company expanded production of LGA packages three years ago, it has delivered more than 60 million units, primarily in MicroLeadFrame(TM) (MLF MLF Malolactic Fermentation (winemaking) MLF Medial Longitudinal Fasciculus MLF Micro Lead-Frame MLF Multilateral Force MLF Mouvement de Libération de la Femme ) and ChipArray(R) packages, to customers producing cellular telephones, digital cameras, personal computer components and other portable electronic devices. Amkor also has delivered more than 1 million of System in Package (SiP) units in LGA configuration to these same customers over the past year. "We see a significant growth in the demand for these packages as OEMs increase production of leading edge, portable consumer products," said Robert Darveaux, vice president of new package engineering for Amkor. "We believe we have delivered more LGA packages than all other contract packagers combined and we see production of these packages growing to more than 1 billion over the next two years." According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Prismark Partners, "LGAs are becoming the preferred package for use with modules such as visible caching operating systems Operating systems can be categorized by technology, ownership, licensing, working state, usage, and by many other characteristics. In practice, many of these groupings may overlap. (VCOs), power amplifiers (Pas), and switches that are used in mobile communications products. LGAs offer reduced height without a sacrifice in reliability or ease of assembly." LGA packages reduce integrated circuit mounted height by eliminating the solder balls that are used for mounting ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) packages to system circuit boards. Instead, LGA packages are either socketed or, in most recent applications, reflow-mounted using solder that has been applied to the board. At a 0.8 mm (chip scale) mounting-pad pitch, the LGA solder-reflow mounting technique reduces component height above the circuit board by 0.15 to 0.25 mm compared to BGAs. The process also improves high-frequency electrical performance by shortening the signal path and improves system reliability by increasing solder joint resistance to stress failures caused by deflections of the system board. Improved radio-frequency performance and resistance to mechanical stress failures are both important issues to cellular telephone handset makers. In addition to MLF, SiP and ChipArray, engineering efforts have already established design rules for major BGA package families, including flex, tape array and chip scale. "We can adapt the LGA format to any ball grid array package," Darveaux said. "And we can design the package to fit the footprint of any leadframe product." About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. Forward-Looking Statement forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. : This news release may contain forward-looking statements that involve risk and uncertainty that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the outcome of events set forth in these statements and that would affect the company's operating results and financial condition is detailed in the company's filing with the Securities and Exchange Commission, including the Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the fiscal year ended December 31, 1999. 2000-23 08/07/00 |
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