Amkor Technology Transfers FOC and RDL.

Business Editors/High-Tech Writers

CHANDLER, Ariz.--(BUSINESS WIRE)--Dec. 4, 2001

Amkor Technology (Nasdaq - AMKR) announces the successful transfer of Kulicke & Soffa Industries Inc., (Nasdaq - KLIC) Flip Chip Division's Flex-on-Cap and Redistribution (FOC and RDL) wafer bumping technologies. Amkor's wafer bumping facility in Gwangju, Korea is available for immediate production, offering a monthly capacity of 10,000 200mm wafers. Amkor completed a rigorous 35-step certification audit and conformed to yield expectations set by K&S's Flip Chip Division of Phoenix, AZ.

"The results of the FOC transfer really speak for themselves," according to Richard Groover, Vice President of Flip Chip Development at Amkor. "We transformed an empty space into a customer certified operation in ten months, and are moving quickly into production and down a continuous improvement path." Mr. Groover adds, "Amkor is looking to expand the application space for this technology as much as possible. FOC is proving to be robust and reliable, and will remain one of our core processes moving forward."

"Amkor's fast ramp demonstrates the flexibility and adaptability of our process," said K&S Vice President, Technology Licensing Don R. May. "We look forward to continuing to work with Amkor to bring additional industry leading advances, such as lead-free alloys and copper compatible bump processes, into production."

Amkor Technology has been in production of flip chip packages since the first quarter of 2000, having produced in the millions of units to date. By adding wafer bumping capability, Amkor completes its turnkey service offering for flip chip providing substrate design, wafer-level electrical testing, package assembly, and final test. Amkor offers these services as either a virtual factory or a one-roof solution depending on customer's logistical and geographic preferences.

The need for flip chip interconnection is driven by an increased demand in high performance semiconductors targeting chipsets, graphics, network switching, power management, and ASICs. Fundamentally, flip chip offers superior electrical characteristics and the smallest footprint of competing solutions in the industry. The addition of wafer bumping capability represents yet another step in Amkor's efforts to offer its customers leading technology solutions.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

About Kulicke & Soffa and FCT: Located in Phoenix, AZ, FCT is a division of Kulicke & Soffa. Kulicke & Soffa is the world's leading supplier of semiconductor interconnect equipment, materials and technology. Chip and wire solutions combine wafer dicing, die bonding and wire bonding equipment with saw blades, die collets, wire and capillaries. Flip chip solutions include wafer bumping technology, die placement equipment and UltraVia high density substrates. Chip scale and wafer level packaging solutions include Ultra CSP technology. Test interconnect solutions include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, and test sockets and contactors for all types of packages. Kulicke & Soffa's web site address is www.kns.com.