Amkor Technology Qualifies Four New 1.0mm Thin Stacked CSP Products; Expands Industry's Broadest 3D Packaging Family.Business Editors/High-Tech Writers CHANDLER, Ariz.--(BUSINESS WIRE)--May 9, 2002 Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, Inc. (Nasdaq: AMKR AMKR Amkor Technology ) announced today that it is the first to qualify a family of two die Stacked Chip Scale Packages A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. According to the IPC, to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die that is being packaged. (S-CSP S-CSP Stacked Chip-Scale Package ) to meet 1.0mm low profile requirements for size and weight reduction in new generation wireless handsets. The four new S-CSP products allow the stacking of a wide range of combinations, including devices that are the same or similar die size, through the use of low profile wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The wire is generally made up of one of the following:
"Amkor's qualification of this new 1.0mm stack CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P family, is significant because it matches well with the move to 1.0mm high chip capacitors. This allows for broader design flexibility to integrate more features and functions without sacrificing our size reduction roadmaps," said Yasunori Tanaka, Manager of Engineering for NEC's Mobile Terminal Technology Development Division. Amkor has developed the industry's broadest 3D packaging product family by following a two-phase technology / product development and qualification strategy. The first phase implemented a continuous improvement of the underlying platform materials and process technologies, including advanced wafer thinning through handling; film or paste die attach; thin spacer assembly for same size die stacking; low loop and stand off stitch wire bonding; and high performance lead free and green materials on advanced substrate technologies. The second phase applied these 3D platform technologies across Amkor's broad leadframe and laminate laminate, n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth. based semiconductor packaging portfolio to meet a wide range of applications and diverse device combinations that deliver higher levels of silicon efficiency. Ted Tessier, Vice President of Amkor's Advanced Applications Group stated, "The capabilities qualified in this new 1.0mm Stack CSP family, coupled with our commitment to aggressively execute our 3D packaging strategy, has enabled Amkor to deliver customer samples for a 1.0mm 4 die stack CSP using 75 micron micron: see micrometer. One micrometer, which is one millionth of a meter or approximately 1/25,000 of an inch. The tiny elements that make up a transistor on a chip are measured in micrometers and nanometers. See process technology. thin die. In addition, we recently received a significant design win to develop and qualify a high density 3 die stack CSP for logic + memory applications. Our opportunities for 3D solutions in both die and package stacking are exploding as the industry embraces the benefits that 3D packaging provides for system and silicon integration." About Amkor: Amkor is the world's largest provider of contract microelectronics assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. |
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