Amkor Technology Opens U.S. Based Flip Chip Development Center; Already Developing Flip Chip Solutions for Ten IC Manufacturers.WEST CHESTER West Chester, borough (1990 pop. 18,041), seat of Chester co., SE Pa., W of Philadelphia; inc. 1799. Primarily residential, West Chester was long the trade and processing center for an agricultural region that is now mainly suburbs. , Pa.--(BUSINESS WIRE)--May 27, 1999-- Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, Inc. (Nasdaq:AMKR AMKR Amkor Technology ), the world's largest provider of contract semiconductor packaging and test services, has opened a United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. facility for the development of flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done package technology. The Advanced Packaging Development Center, located in Chandler, Ariz., offers complete design services and prototype engineering support for on-shore flip chip development programs. Currently development work is underway with ten IC manufacturers. "The Advanced Packaging Development Center will be a great complement to our worldwide package development capabilities," noted John Boruch, president and chief operating officer Chief Operating Officer (COO) The officer of a firm responsible for day-to-day management, usually the president or an executive vice-president. of Amkor Technology. "With the rapid rates of product changes today, this facility allows our customers quicker access to our flip chip capability, enabling them to shorten their product development cycles. As new processes are fully developed, we will transfer those technologies to our high volume production lines overseas." Amkor has a flip chip manufacturing line in its P3 factory in Manila, Philippines. The Advanced Packaging Development Center will concentrate initially on eutectic bumped flip chip packages in three varieties. The first type is called FC CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P or Flip Chip CSP and consists of low pin count packages developed for the portable and handheld market segments which require small footprints and package thickness and good electrical performance. The second type is called FC BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. or Flip Chip BGA and is being developed for mid range applications requiring a low inductance interconnect. The third type is HP FC BGA or High Performance Flip Chip BGA and is targeted for the highest electrical performance and high thermal requirements typical of network servers, workstations and Internet switches. The Advanced Packaging Development Center will be Amkor's primary development location for flip chip packaging, and as such will be involved in new materials, and processes to support future flip chip requirements such as high Pb bumps, Polymer flip chip interconnections, and the like. Amkor's Flip Chip facility is located only 20 minutes from Phoenix Sky Harbor Airport Sky Harbor Airport is the name for several airports including:
About Amkor Technology Amkor Technology Inc. is the world's largest provider of contract semiconductor packaging and test services. The company offers a complete set of semiconductor services including deep submicron wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. , wafer probe testing, IC packaging assembly and design, final testing, burn-in, characterization and reliability testing. More information on Amkor Technology Inc. is available from the company's SEC filings and on Amkor's web site, http://www.amkor.com. Amkor Technology Inc. is traded on the Nasdaq National Market under the symbol AMKR. This release may contain forward-looking statements, such as our expectation that, once fully developed, the Flip Chip technology would be transferred to Amkor's high volume production lines overseas, that are subject to risks and uncertainties. Factors that could cause actual results to differ materially include, but are not limited to, general business conditions in the semiconductor package, test and wafer fabrication industries, fluctuations in the worldwide semiconductor market, technological changes and other risks detailed from time to time in the company's filings with the Securities and Exchange Commission including the company's prospectus or Annual Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the year ended Dec. 31, 1998. |
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