Amkor Technology Nears Qualification of Environmentally Friendly Material Alternatives for Ball Grid Array Packages.Business Editors/High-Tech Writers CHANDLER, Ariz.--(BUSINESS WIRE)--Jan. 16, 2001 Packages Include Lead- and Halide-Free PBGA PBGA Plastic Ball Grid Array , fleXBGA, ChipArray BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. , and TapeArray BGA In response to worldwide environmental concerns, Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, (Nasdaq: AMKR AMKR Amkor Technology ), which already offers lead-free IC packages, soon will offer halide-free versions of the same packages. The company's qualification of halide-free materials used in the assembly of laminate- and tape-based ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA) packages will be complete in April. The packages are widely used in the production of electronic products such as cell phones, graphic cards, and personal digital assistants (PDAs). Amkor began shipping lead-free BGA and leadframe IC packages in 2000. Now, by replacing the halides commonly used as a fire retardant fire retardant Public health A chemical used to resist combustion, which may contain polybrominated biphenyls and antimony oxide in IC components, the company will be able to supply a major product line of environmentally friendly "green" products. Halides, which were present in minute amounts, are being replaced with environmentally safe alternatives such as magnesium oxide magnesium oxide: see magnesia. . Eutectic tin-lead was the alloy most often used for solder spheres in ball grid array manufacturing. After experimenting with several alternatives, Amkor qualified lead-free solder compositions containing tin, silver and copper for its BGA products. These new lead-free alloys require higher process temperatures than eutectic tin-lead, requiring the use of advanced materials and processes capable of withstanding temperatures up to 260 degrees C during the board assembly process. About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. 2001-21 1/16/01 Amkor Technology Nears Qualification of Environmentally Friendly Material Alternatives for Ball Grid Array Packages |
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