Amkor Technology Names Bruce Freyman Executive Vice President.

Business Editors

CHANDLER, Ariz.--(BUSINESS WIRE)--Feb. 14, 2002

Amkor Technology, Inc. (Nasdaq: AMKR) has promoted Bruce Freyman to Executive Vice President for worldwide product and manufacturing operations. With this promotion, Amkor's Board of Directors appointed Freyman as a Corporate Officer.

Freyman, 41, joined Amkor in 1992, following a 10-year career with Motorola, where he was responsible for package development in support of Motorola's cellular, pager and two-way radio divisions. While with Motorola, Freyman was a co-inventor of Ball Grid Array semiconductor package.

At Amkor, Freyman spearheaded the development of the Laminate Product Group, which is now Amkor's largest revenue product family, and he later formed the System-in-Package Group. Freyman assumed responsibility for Amkor's R&D organization in 1998. He broadened his responsibility to include all of Amkor's product business units in 1999, and Amkor's worldwide manufacturing organization in 2001.

Freyman received his B.S. in Chemical Engineering in 1982 and his M.B.A. in 1986.

Amkor is the world's largest provider of contract microelectronics assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and, manufacturing and support services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.