Amkor Technology Awards First Engineering Fellowship.CHANDLER, Ariz.--(BUSINESS WIRE)--Sept. 9, 1999-- James `Mark' Bird Recognized for Contributions to the Field of Worldwide Standardization of Semiconductor Processes, Test Methods and Packaging. Amkor Technology, Inc. (Nasdaq: AMKR AMKR Amkor Technology ), a leading provider of contract microelectronic manufacturing-services, today announced that Director of Technical Marketing, James `Mark' Bird has been awarded the company's first technical fellowship. The honor recognizes Bird with the title of "Fellow" for his contributions to the company and the semiconductor industry through his work on numerous standardization committees. "This ultimate level of technical recognition is well-deserved," said John McMillan, corporate vice president, QRE See Quick Response Engine. and Marketing. "For nearly ten years, Mark has demonstrated leadership and statesmanship in the complex world of worldwide standards committees, where technology and business interact." At Amkor, the position of fellow is equivalent to what other companies call a vice president of technology. It enables outstanding technologists to advance on a parallel track beside their associates who choose to advance through management ranks. In addition to this new title of Fellow, Bird will continue his role as director of technical marketing. Bird is recognized as a senior statesman in the worldwide standards community. He is currently the vice chairman of the Joint Electronic Device Engineering Council See JEDEC. (JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device ) Board of Directors, Chairman for the JEDEC JC-11.11 plastic packaging committee, and chairman of the JEDEC JC-17 micro-electromechanical systems (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ) committee. These committees create the standards for all plastic packages from standard outline to chip-scale and ball-grid arrays. Bird is also the United States Technical advisor and chief delegate to the IEC 47D International Packaging Committee, and is a member of the NEMI NEMI National Electronics Manufacturing Initiative NEMI National Environmental Methods Index and SIA Sia (sī`ə) or Siaha (sī`əhə), in the Bible, family returned from the Exile. SIA - Serial Interface Adaptor Assembly and Packaging roadmap committee. About Amkor Technology Amkor is an industry-leading supplier of contract microelectronic manufacturing-services. The company offers a complete set of services including deep submicron wafer fabrication, wafer probe testing, IC packaging assembly and design, final testing, burn-in, characterization and reliability testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site, http://www.amkor.com. |
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion