Amkor Technology Announces New Process for System-on-a-Chip.West Chester West Chester, borough (1990 pop. 18,041), seat of Chester co., SE Pa., W of Philadelphia; inc. 1799. Primarily residential, West Chester was long the trade and processing center for an agricultural region that is now mainly suburbs. , Pa.--(BUSINESS WIRE)--May 4,1999-- Successful Qualification and Production Release of Ultra Low Power An ultra low power, or ULP device, is an electronic gadget that has milli- or micro-watt power consumption. Some examples of ultra-low power devices:
Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc., (Nasdaq: AMKR AMKR Amkor Technology ), today announced that through cooperative efforts with Anam Semiconductor, Inc., the ultra low power 1.8V process (known as aa 18LP) has successfully completed qualification in Anam's semiconductor fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. facility and is now available for production. "Companies creating System-on-a-Chip solutions can take advantage of the aa 18LP process to produce systems that are at least equal in performance to standard 0.25um solutions, but with dramatically reduced power consumption and system costs", Eric Larson, Executive Vice President of Amkor Wafer Fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Services (AWFS AWFS Association of Woodworking & Furnishings Suppliers ), a division of Amkor Technology, Inc. "This new process is ideal for companies seeking improved performance and reduced system costs since these costs are more often than not dictated by the need to dissipate power and heat. Coupled with Amkor's leadership position in assembly and test, we now have the premier solutions for customers that combines the best of all technologies from silicon through packaging to systems," added Larson. The 18v, aa 18LP process features shallow trench isolation Shallow trench isolation (STI) is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. , self-aligned contacts, extremely low leakage currents and a single Polysilicon layer with up to 5 layers of metal interconnects. The aa 18LP uses a dual gate process, allowing the internal core voltage to be 1.8V and the input/output devices to operate at 3.3V. The transistor architecture has been optimized for low voltage operation, specifically targeted for battery operated hand-held and mobile applications like cell phones, personal communications devices, and watches. Amkor provides support for the aa 18LP process with its Flexible FAB Express program, a multi-project wafer program that releases a new mask run as often as twice a quarter. The program allows customers and IP providers to evaluate silicon manufactured by Amkor while incurring minimal financial risks. Amkor's unique twist to running multi-project wafers includes combining aa 18LP designs on the same mask reticle ret·i·cle n. A grid or pattern placed in the eyepiece of an optical instrument, used to establish scale or position. [Latin r as designs targeted for other Amkor processes. This approach also allows System-on-a-Chip customers to evaluate the same design on any of Amkor's processes at the same time. Amkor Wafer Fabrication Services (AWFS) provides dedicated "pure play" contract-manufacturing services for high performance digital CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. semiconductors and offers 0.25 um and 0.21 um processes through a state-of-the-art wafer fabrication center located in Buchon, South Korea. Companies or customers seeking information on AWFS products or services should contact LT Guttadauro, Director of Sales Development at 408/496-0303 or call toll free 877/FabGuys (U.S.), or (33) 4.72.78.55.00 (Europe). About Amkor Technology Amkor Technology, Inc. is the world's largest provider of contract semiconductor packaging and test services. The company offers a complete set of semiconductor services including deep submicron wafer fabrication, wafer probe testing, IC packaging assembly and design, final testing, burn-in, characterization and reliability testing. More information on Amkor Technology, Inc. is available from the company's SEC filings and on Amkor's web site, http://www.amkor.com. Amkor Technology, Inc. is traded on the Nasdaq National Market under the symbol AMKR. This release may contain forward-looking statements that are subject to risks and uncertainties. Factors that could cause actual results to differ materially include, but are not limited to, general business conditions in the semiconductor package, test and wafer fabrication industries, fluctuations in the worldwide semiconductor market, technological changes and other risks detailed from time to time in the company's filings with the Securities and Exchange Commission including the company's prospectus or Annual Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the year ended December 31, 1998. |
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion