Amkor Offers Synergy Between Silicon, Package and Test; Silicon-Package Architecture Technology to Address Integrated Silicon-Through-Packaging Capabilities.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 11, 1997--Amkor, a leading provider of complete integrated circuit (IC) contract manufacturing services to the global semiconductor industry, provides the synergy of package technology with leading edge silicon design technology, Silicon-Package Architecture (SPA).

The continued growth in semiconductor complexity and performance creates both opportunities and challenges for leading edge semiconductor design and manufacturing. SPA is the technology synergy that addresses truly integrated silicon-through-packaging capabilities offering customers complete solutions, reducing time-to-market and improving cost and performance, at both the IC and system levels.

According to Moore's law, semiconductor complexity will continue to double every two years, with performance doubling every 18 months. As semiconductor complexity and performance grow, manufacturing, assembly, packaging and test issues become more complex. The implications of semiconductor package thermal, electrical, cost, size and reliability constraints require explicit consideration in each hierarchy of silicon design, manufacturing and testing. Today's electronic system architects and IC designers must make even more effective use of the potential packaging technologies, because packaging features and performance are crucial to silicon features and performance.

With SPA, Amkor Technology, Inc., is able to work with customers to address the increasingly complex electrical, mechanical and thermal issues in their system by leveraging the synergy in engineering solutions that encompasses each hierarchy of the semiconductor design process.

According to Tom Arnold, Amkor Wafer Fabrication Services Vice President of Engineering, much of the cost-performance improvement needed as the semiconductor industry advances will be closely tied to packaging capabilities. "SPA is our methodology to enable our customers to address the system design trade-offs that surround the optimal cost, size, thermal dissipation and electrical performance objectives for the system. SPA is a synergistic design concept that includes the concepts of design for manufacturability and design for testability, both crucial elements in semiconductor reliability, quality, manufacturing productivity and time-to-market."

About Amkor Wafer Fabrication Services

Amkor is a global provider of integrated semiconductor contract manufacturing services. It offers Silicon-Package-Architecture (SPA) that synergistically focuses Amkor's Assembly and Test Services expertise in semiconductor packaging together with Amkor's Wafer Fabrication Services new deep-sub-micron semiconductor manufacturing technology. Sales, marketing and customer support engineering for Wafer Fabrication Services are located in Santa Clara, CA, Boise, ID and Ferney-Voltaire, France. For additional information, please visit Amkor's World Wide Web site at http://www.amkor.com . -0-

Note to Editors: Silicon-Package Architecture and (SPA) are trademarks of Amkor Wafer Fabrication Services. All other product or company names are trademarks or registered trademarks of their respective companies.

See Amkor press release distributed November 11, 1997, "Amkor Wafer Fabrication Services Opens Deep Submicron CMOS Wafer Fab Business"

Photos available upon request.

CONTACT: Amkor Wafer Fabrication Services

John Weekley, 408/496-0303 x2245

[e-mail]