Amkor Joins IBM, Chartered and Samsung to Broaden Common Platform Technology Offerings with Package and Test Solutions for Advanced Silicon Processes.Cross-collaboration Positions Amkor to Provide Customer Ready Technologies CHANDLER, Ariz. -- Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc. (Nasdaq: AMKR AMKR Amkor Technology ) today announced that it is collaborating with IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries) , Chartered Semiconductor Manufacturing Chartered Semiconductor Manufacturing SGX: C27 NASDAQ: CHRT (abbreviated CSM) is the world's fourth largest dedicated independent semiconductor foundry, with its headquarters and main operations located in the Woodlands Industrial Park, Kranji Singapore. and Samsung Electronics Samsung Electronics (SEC, Hangul:삼성전자; KSE: 005930, KSE: 005935, LSE: SMSN, LSE: SMSD) is a South Korean multinational corporation and the world's largest and leading electronics and information technology company. Co., Ltd. in qualifying 90-nanometer (nm) and 65nm flip-chip packaging and design capabilities for Common Platform technology. Amkor has already qualified several die and package combinations at both 90nm and 65nm with several new 65nm qualifications in process for the Common Platform partners. Additionally, Amkor has started 45nm qualifications for next-generation semiconductor applications. Common Platform technology is a collaborative effort by IBM, Chartered, and Samsung to create an open and flexible design and manufacturing environment at leading-edge semiconductor technologies down to 45nm and beyond. With this newest collaboration for optimizing silicon/package interaction for Common Platform technology, customers can now leverage this cross-foundry manufacturing approach to achieve even more complete market solutions. "It's a simple equation. Successful commercialization of next generation semiconductor technology requires not only advanced silicon, but also the combination of appropriate assembly and test technologies and proven manufacturing scale," said Mike Barrow barrow, in archaeology barrow, in archaeology, a burial mound. Earth and stone or timber are the usual construction materials; in parts of SE Asia stone and brick have entirely replaced earth. A barrow built primarily of stone is often called a cairn. , Amkor's senior vice president, flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done business unit. "Changing from individual efforts to joint collaboration with Common Platform partners provides Amkor with early access to advanced silicon, enhancing our ability to develop assembly and test collateral for next-generation applications." "Extending the Common Platform technology ecosystem to include collaboration on advanced wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. bump and flip chip processes is a natural step in our evolution to provide clients complete solutions," said Kevin Meyer, vice president of worldwide marketing and platform alliances at Chartered. "Amkor's commitment to Common Platform-based technology for partnering on optimized solutions involving manufacturing, packaging and test benefits the entire user community. Additionally, Amkor's commitment to Singapore as a base for Common Platform technology packaging and test services will greatly reduce our customers' time to market." "Today's announcement underscores the importance that we attach to incorporating advanced assembly and test technology into the Common Platform technology ecosystem," said Ana Hunter, vice president of technology for Samsung Semiconductor, Inc. "We are proud to welcome Amkor as a member of the Common Platform ecosystem, noting that in having already qualified the 65nm process for wafer bump and flip chip assembly, Amkor can provide market-ready solutions for customers. As part of our ongoing collaboration, Amkor and Samsung are also working on lead-free bump and assembly solutions, and we look forward to continuing these efforts as they advance to the 45nm process node." "Our collaboration with Amkor began in 2004 and continues to provide both IBM and its partners with significant value. Amkor has demonstrated a proven track record in delivering 90nm Common Platform technology solutions, most recently addressing the needs of next generation gaming applications with turnkey See turnkey system. flip chip packaging" said Steve Longoria, vice president, Semiconductor Technology Platform for IBM Technology Collaboration Solutions. "The addition of Amkor as a Common Platform technology ecosystem solutions provider enhances our client offerings with the necessary packaging roadmaps, assembly, and test technologies expected by leading edge technology adopters." "In the past twelve months, Amkor has delivered over 10 million flip chip packages containing 90nm Common Platform silicon from multiple foundries for the gaming market. This proven track record for turnkey package execution has shown Amkor's ability to deliver Customer Ready Technologies to the Common Platform ecosystem," said Amkor's Mike Barrow. "Now we can work more collaboratively with all joint development partners to address increasingly difficult chip-to-package interactions on advanced silicon nodes before customer products are even finalized See finalization. ." About Amkor Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic The miniaturization of electronic circuits. See chip. design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. About the Common Platform Technology Collaboration IBM, Chartered and Samsung have broken new ground in the semiconductor industry with a unique collaboration focused on leading-edge, jointly developed digital CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. , IP, and design services industries. This ecosystem allows foundry customers to easily source their chip designs to multiple 300mm foundries with unprecedented flexibility and choice. Common Platform technology features 90nm, 65nm, and 45nm process technologies developed as part of a collaboration between IBM, Chartered, Samsung and Infineon. Forward Looking Statements This press release contains forward looking statements within the meaning of the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995 that involve risks and uncertainties, including but not limited to statements regarding supporting Common Platform members with package and test solutions; qualifications on 90nm, 65nm and 45nm silicon; collaboration with joint development partners; gaining access to next generation silicon; developing assembly and test collateral; providing market-ready solutions for customers; expansion of wafer bump, probe and test services; and collaboration on lead-free bump and assembly solutions. These statements are subject to a number of risks and uncertainties that could cause actual results to differ from our expectations, including, but not limited to: consumer demand for products incorporating packages based on Common Platform technologies; our relationships with IBM, Chartered and Samsung; and our ability to successfully qualify packages on 45nm silicon, work with joint development partners on Common Platform technology, and implement market-ready and lead-free bump and assembly solutions. Further information on risk factors that could affect the outcome of the events set forth in these statements and that could affect the company's operating results and financial condition is detailed in Amkor's filings with the Securities and Exchange Commission, including the Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the year ended December 31, 2005 and Form 10-Q Form 10-Q See 10-Q. for the quarter ended March 31, 2006. |
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