Amkor Continues Expansion of 300mm Wafer Bumping Capacity with SUSS MicroTec Lithography Solutions.MUNICH, Germany -- SUSS suss tr.v. sussed, suss·ing, suss·es Slang 1. To infer or discover; figure out: "I think I'm good at sussing out what's going on" Ry Cooder. MicroTec (FWB (Fixed Wireless Broadband) See fixed wireless. :SMH SMH Sydney Morning Herald (Australia) SMH St Michael's Hospital SMH Shaking My Head SMH Strong Memorial Hospital SMH Sanders Morris Harris Inc. SMH Screening for Mental Health, Inc. ) (GER GER German/Germany GER Gastroesophageal Reflux GER Geriatrics GER General Education Requirement GER Great Eastern Railway (UK) GER Gross Enrollment Ratio (education) GER Gain Electrons Reduction :SMH) announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc. Singapore. The system installations were completed in Q3 of 2006. The deal includes an MA300Plus Full Field Exposure System and an ACS (Asynchronous Communications Server) See network access server. 300Plus Coating Cluster, equipped with a special GYRSET cover technology that improves coating uniformity. Amkor has selected SUSS lithography systems to commence its' wafer bumping service in Singapore to support emerging applications on 300mm wafers. Equipment installations are already well underway. "Recognizing both the increasing adoption of flip chip and wafer level packaging, and strong customer acceptance of our Unitive u·ni·tive adj. Serving to unite; tending to promote unity. processes, Amkor is increasing wafer level processing capacity at multiple production sites in North America and Asia," explained Daniel Teng Amkor's Sr. Vice General Manager WLP WLP WebLogic Portal (Bea Systems) WLP Wafer Level Packaging WLP Women's Learning Partnership (Bethesda, MD) WLP Workplace Learning & Performance WLP World Library Partnership, Inc. Operations. "This order is a direct result of our positive experience with SUSS MicroTec lithography tools, and fits our expansion needs perfectly. We also plan to install additional SUSS lithography systems at our factories in Taiwan and North Carolina." "Lithography for 300mm wafer-level packaging and wafer bumping is quite different from that for other applications. The packaging process is extremely cost-sensitive and requires nearly perfect yield with very thick photoresist and photopolymer A photopolymer is a polymer which is cured by exposure to light, often in the ultraviolet spectrum. These polymers are useful in dentistry for fillings and in rapid prototyping in the stereolithography and PolyJet processes. layers. We are very pleased to be the lithography partner of choice to Amkor," comments Rolf Wolf, Managing Director of the SUSS MicroTec Lithography Division. SUSS and Amkor have worked together very closely in recent years (e.g. SECAP SECAP Scientific & Engineering Capability ) in order to drive back-end lithography to the next level. The latest generation SUSS MA300Plus exposure system with its sub-micron alignment capability in combination with modern resist and polymer material has completely eliminated the need for 1x stepper step·per n. 1. One that steps, especially in a fast or spirited manner. 2. Informal A dancer. Noun 1. technology, thus drastically reducing the per-wafer cost for Amkor. The inherent cost advantages, flexibility, and ease of use make SUSS production lithography systems extremely attractive solutions for different wafer level packaging technologies, including solder bumping, gold bumping, redistribution layers (for wafer level packages and chip stacking) or re-passivation. Most importantly SUSS lithography equipment has been proven especially well suited for production processes where either the resist thickness or wafer topography exceeds several microns and ranges up to several hundred microns. About SUSS MicroTec SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com About Amkor Amkor Technology, Inc. is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and, manufacturing and support services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made. |
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