Amkor Adds Latest Packaging Equipment to Advanced Prototype Development Lab.
Business Editors/High-Tech Writers
CHANDLER, Ariz.--(BUSINESS WIRE)--Oct. 17, 2000
To meet increased customer focus on advanced flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done and system-in-package production, Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, (Nasdaq: AMKR AMKR Amkor Technology ) has added the latest equipment from several manufacturers to its expanding prototype package development lab here.
The lab, which opened last year to assist U.S.-based semiconductor companies with local development of advanced packages, has been expanded to include the newest systems for ball attach, wire bond and die attach processes.
"The lab was developed to ensure that our customers move from concept to production in the shortest possible time," said Jonathon Greenwood, senior director of Amkor's Advanced Package Development Center. "In combination with our adjacent design center, the lab specializes in reducing the time between concept and delivery for advanced flip chip and system-in-package ICs, which is a major advantage for customers.
"Amkor has invested in the lab equipment and technology to ensure that we continue to be technology leaders and to assure customers that their products are reliable, cost efficient and can be manufactured in high volumes with the greatest potential for success," Greenwood said.
In addition to advanced and traditional packaging equipment, the expanded laboratory operates one of the first laser solder ball In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. attachment systems in service. The system, a Kulicke and Soffa 9388 Laser Pro, uses a laser for solder reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. at rates up to 30 balls per second and accuracy of 5 microns. Also added are two high-speed, fine-pitch K&S 8028 wire bond systems with bonding speeds in excess of 10 wires per second at 60 micron in-line bond pad pitch. A third system, a Datacon APM (Advanced Power Management) A programming interface (API) from Intel and Microsoft for battery-powered computers that lets programs communicate power requirements to slow down and speed up components. See ACPI.
APM - Advanced Power Management flip chip die attach system, is capable of 10 micron placement repeatability at 3 sigma.
"Our goal is to provide customers with high quality prototypes in a very short cycle time once the design and materials are received," said Steve Shermer, operations director for the center. "By locating the lab in Arizona, we can sharply reduce development time on these new technologies. We offer some of the most advanced prototype packaging capabilities in the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. ."
To further the speed time to production, all package data, including production processes, reliability reports, drawings, equipment process programs and other manufacturing information, can be transmitted electronically from the lab in Arizona to Amkor production facilities in Korea and the Philippines.
About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. ; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module A Multi-Chip Module or MCM is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
Editors: Photographs of the lab and equipment are available at: http://www.amkor.com/PR101700_APDC/index.htm
2000-28 10/17/00 AMKOR ADDS LATEST PACKAGING EQUIPMENT TO ADVANCED PROTOTYPE DEVELOPMENT LAB