Amkor Adds Latest Packaging Equipment to Advanced Prototype Development Lab.
CHANDLER, Ariz.--(BUSINESS WIRE)--Oct. 17, 2000
To meet increased customer focus on advanced flip chip and system-in-package production, Amkor Technology (Nasdaq: AMKR) has added the latest equipment from several manufacturers to its expanding prototype package development lab here.
The lab, which opened last year to assist U.S.-based semiconductor companies with local development of advanced packages, has been expanded to include the newest systems for ball attach, wire bond and die attach processes.
"The lab was developed to ensure that our customers move from concept to production in the shortest possible time," said Jonathon Greenwood, senior director of Amkor's Advanced Package Development Center. "In combination with our adjacent design center, the lab specializes in reducing the time between concept and delivery for advanced flip chip and system-in-package ICs, which is a major advantage for customers.
"Amkor has invested in the lab equipment and technology to ensure that we continue to be technology leaders and to assure customers that their products are reliable, cost efficient and can be manufactured in high volumes with the greatest potential for success," Greenwood said.
In addition to advanced and traditional packaging equipment, the expanded laboratory operates one of the first laser solder ball attachment systems in service. The system, a Kulicke and Soffa 9388 Laser Pro, uses a laser for solder reflow at rates up to 30 balls per second and accuracy of 5 microns. Also added are two high-speed, fine-pitch K&S 8028 wire bond systems with bonding speeds in excess of 10 wires per second at 60 micron in-line bond pad pitch. A third system, a Datacon APM flip chip die attach system, is capable of 10 micron placement repeatability at 3 sigma.
"Our goal is to provide customers with high quality prototypes in a very short cycle time once the design and materials are received," said Steve Shermer, operations director for the center. "By locating the lab in Arizona, we can sharply reduce development time on these new technologies. We offer some of the most advanced prototype packaging capabilities in the United States."
To further the speed time to production, all package data, including production processes, reliability reports, drawings, equipment process programs and other manufacturing information, can be transmitted electronically from the lab in Arizona to Amkor production facilities in Korea and the Philippines.
About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
Editors: Photographs of the lab and equipment are available at: http://www.amkor.com/PR101700_APDC/index.htm
2000-28 10/17/00 AMKOR ADDS LATEST PACKAGING EQUIPMENT TO ADVANCED PROTOTYPE DEVELOPMENT LAB
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|Date:||Oct 17, 2000|
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