Amkor's etCSP is World's Thinnest BGA Package; Enables Stacking 'Known Good Devices' for Flexibility, Reliability.Business Editors/High-Tech Writers CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 8, 2001 Stacking two or more packages that have been fully tested, completed burn-in and been verified as 'known good devices,' is a reality using Amkor Technology's (Nasdaq:AMKR AMKR Amkor Technology ) etCSP(TM) package configuration. Stacked etCSP(TM) packages provide reliability and flexibility to designers requiring the extra performance of an extremely thin, multiple-chip system, but who lack space on the motherboard. "Stacked etCSP designs allow a 'system in a stack' approach to mixing different technologies such as memory, logic and mixed signal in a thin or small form factor," said David Zoba, Amkor's etCSP(TM) product manager. "Because the individual packages have already been tested and verified, the system in a stack approach provides much greater flexibility when integrating various devices into an optimized system such as Bluetooth(TM)." A single package has a total height of 0.35 to 0.5 mm, while stacks of two and three packages have mounted heights that range between 0.7 - 1.0 mm and 1.1 - 1.7 mm, respectively. For higher stacks, package thickness depends on the number of printed circuit layers required in the high-density package on the bottom of the stack, according to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Zoba. The initial adoption for the etCSP(TM) package was in PCMCIA (Personal Computer Memory Card International Association, San Jose, CA, www.pcmcia.org) An international standards body and trade association that was founded in 1989 to establish a standard for connecting peripherals to portable computers. PCMCIA created the PC Card. See PC Card. Type II removable hard disk (storage) removable hard disk - A type of magnetic disk, or possibly magneto-optical disk which is not permanently attached to the disk drive (not a fixed disk) but which can be taken out and replaced, allowing many disks to be used in the same drive. drives. Stacked etCSP(TM) packages are being evaluated for application in MP3 players and memory cards that use high-capacity flash memory devices requiring test and burn-in before stacking to eliminate the risk of device yield loss. Other areas of interest for the stacked etCSP(TM) design include cell phone and personal communication applications where features and functions continue to be added without compromising size and weight reduction roadmaps. The base etCSP(TM) package is constructed from a thin-core organic laminate with full sized 0.3 mm diameter solder balls on a standard 0.5 mm pitch. Conventional mold compound holds the wirebonded die in the "bottomless" cavity of the package. This unique package structure has proven to be more reliable than competing packages or bare die See bare chip. applications. Amkor is making this extremely thin packaging technology available to a wider range of die sizes and stacked device uses. About Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, : Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. ; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module A Multi-Chip Module or MCM is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. |
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion