Amkor's Flip-Stack(TM) Package Turns the Table on Conventional Stacked CSP Packages.CHANDLER, Ariz. -- New Stacked CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P Package Combines Amkor's Leadership in Flip Chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done with Advanced Wirebond Technology for High Performance Portable Products Semiconductor packaging leader Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc. (Nasdaq:AMKR AMKR Amkor Technology ) today announced an innovative Flip-Stack(TM) package solution that is specifically designed to support to emerging transition from wire-bond to flip chip interconnect for high-performance DSPs, ASICs and Radio Frequency ICs in a broad range of consumer applications, including wireless handsets, digital cameras and digital entertainment. Although 3D stacked die packages based on wirebond interconnect have been in high volume production for several years, advancements in wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. technology are driving the transition to flip-chip for performance reasons. Amkor's Flip-Stack CSP package targets devices utilizing advanced IC fab processes and combines Amkor's Flip-Chip process with conventional wirebond technology to offer a cost-effective, high-performance 3D package solution. Flip-Stack CSP enables higher levels of silicon integration and device performance by stacking flash or mobile DRAM memory over high performance logic chips, such as DSP (1) (Digital Signal Processor) A special-purpose CPU used for digital signal processing applications (see definition #2 below). It provides ultra-fast instruction sequences, such as shift and add, and multiply and add, which are commonly used in math-intensive and ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. . In the Flip-Stack CSP configuration, the bottom logic device is attached to the package substrate using Pb-free flip-chip solder bumps; the top ICs are then attached to the flip-chip die and wirebonded to the package substrate. Amkor's Flip-Stack CSP is Pb-free and RoHS compliant, and is offered in a standard FBGA FBGA Fine-Pitch Ball Grid Array FBGA Fine Pitch Bga FBGA Fine Line Bga package outline. Amkor's Flip-Stack CSP package offers a flip chip interconnect that addresses the growing need for improved electrical performance in consumer products containing high performance components, such as baseband processors and radio frequency ICs. For high pin-count devices, Flip-Stack's flip chip architecture reduces the wiring complexity compared with traditional wirebond stacked CSP packages. In addition, the flip chip architecture means that Flip-Stack CSP may in some cases be designed into a smaller footprint than traditional wirebond stacked CSP. The Flip-Stack package platform will also support the integration of passive devices within the package to enable total System-in-Package functionality. "Our Flip-Stack CSP package provides a cost-effective solution for those applications or devices requiring 3D integration with enhanced electrical performance, higher interconnect density and smaller footprint," said Christopher Scanlan, Amkor's Vice President, Package Development. "Flip-Stack CSP provides significant size and performance advantages over traditional wirebond stacked packaging approaches. As design rules for consumer electronics demand greater functionality, more speed, higher frequencies, lower inductance inductance, quantity that measures the electromagnetic induction of an electric circuit component; it is a property of the component itself rather than of the circuit as a whole. and smaller system footprints, Amkor will continue to refine our leadership position in Flip-Chip processes and 3D packaging." About Amkor Technology, Inc. Amkor Technology, Inc. is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. |
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