Amkor, Zuken Sign Joint Technology Partnership for the Design of Advanced IC Packaging.Business Editors/Hi-Tech Writers WEST CHESTER West Chester, borough (1990 pop. 18,041), seat of Chester co., SE Pa., W of Philadelphia; inc. 1799. Primarily residential, West Chester was long the trade and processing center for an agricultural region that is now mainly suburbs. , Pa.--(BUSINESS WIRE)--April 12, 2000 An automated design process that will significantly reduce customer cycle times and the design difficulties encountered in the development of advanced integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) packages is being developed through a technology partnership between Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc., (Nasdaq: AMKR AMKR Amkor Technology ) and Zuken USA, Inc. Streamlining this process is a major step in Amkor's multi-million advanced technology development program, which is enhancing Amkor's industry leadership in IC package design and development. The partnership will develop an expert system-based design tool that uses a customer's electrical design requirements to rapidly develop optimal IC package designs using the latest manufacturing design guidelines and that produces all required documentation files. Under the technology partnership, the companies will work together to integrate Zuken design solutions into Amkor's advanced IC packaging processes to achieve accurate right-first-time design-for-manufacturing results that meet the customer's electrical performance requirements. "Knowing customer needs, and the capabilities of the substrate suppliers and the assembly site, we can use this tool to achieve accurate designs ready for manufacturing with very short lead times," said Randy Holman, vice president of design services for Amkor. "This literally means we can go from concept to manufacturing in hours instead of weeks. That's a critical difference for many of our customers." Using customer-supplied IC criteria, such as die size, bond pad locations and netlist, the Amkor/Zuken design tool creates an electronic design for the package. The output can be transferred electronically to the suppliers. "This agreement is a clear recognition of Zuken's global leadership and expertise in advanced packaging," said Paul Ewing, vice president of Zuken USA's North American operations North American operation Surgical oncology Radical surgery of a 'frozen pelvis', consisting of radical en bloc resection of the uterus and urinary bladder. See 'Frozen pelvis.'. Cf 'All-American' and 'South American' operations. . "It will enable Amkor to stay at the forefront of packaging design and will deliver the ultimate advanced IC packaging design solutions to the marketplace." "The advanced technology included in this agreement assists Amkor in achieving a substantial increase in the number of designs that can be pushed through the package development cycle," Ewing said. The technology partnership will integrate and automate the entire design process for multiple packaging technologies including BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. , CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P , flip chip, multi-chip packages and modules. A key feature will be the development of improved solutions for wireless frequency analysis and auto-routing of advanced IC packages. Glossary: BGA: Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. , an area array package utilizing solder balls to attach the package to the printed circuit board CSP: Chip Scale Package A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. According to the IPC, to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die that is being packaged. , an array package with ball pitch under 1.0 mm Flip Chip: A semiconductor package that is flipped faced down and connected to the circuit board Modules: Multiple die with passive components (resistors, capacitors, inductors) About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. About Zuken: Since its establishment in 1976, Zuken has evolved into a provider of solutions that maximize the efficiency of the design and manufacturing process of electronics companies around the world. Zuken specializes in professional software solutions for the design of PCB/MCM's, IC packages and systems. The product suite offers a wide range of advanced tool sets from schematic capture, placement, routing and analysis through to manufacture and test. These solutions are provided under both UNIX UNIX Operating system for digital computers, developed by Ken Thompson of Bell Laboratories in 1969. It was initially designed for a single user (the name was a pun on the earlier operating system Multics). and Microsoft Windows operating systems. With its main development centers in Japan and the UK and a world-wide network of sales and service centers, Zuken employs over 1,000 people. This structure is further enhanced by an international network of distribution and business partners. The company has built both a solid customer base and a reputation as the definitive force in electronic product design. Zuken is listed in Section 1 on the Tokyo Stock Exchange Tokyo Stock Exchange Main stock market of Japan, located in Tokyo. It opened in 1878 to provide a market for the trading of government bonds newly issued to former samurai. and is capitalized at more than $1B. For more information, visit http://www.zuken.com. Forward-Looking Statement forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. : This news release may contain forward-looking statements that involve risk and uncertainty that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the outcome of events set fourth in these statements and that would affect the company's operating results and financial condition is detailed in the company's filings with the Securities and Exchange Commission, including the report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the fiscal year ended December 31, 1999. |
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