Printer Friendly
The Free Library
19,585,939 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Altera EPC16 Device in Stacked-Chip Packaging: Good Things Come in Small Packages.


Business Editors/High Tech Writers

SAN JOSE San Jose, city, United States
San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850.
, Calif.--(BUSINESS WIRE)--March 5, 2001

Altera Corporation (Nasdaq:ALTR), a leading supplier of programmable logic devices See PLD.  (PLDs), today announced the immediate availability of the industry's first configuration device featuring stacked-chip technology allowing Altera to offer the industry's highest density configuration device in the smallest package.

Altera's EPC (1) (Entertainment PC) See HTPC.

(2) (Electronic Product Code) A standard code for RFID tags administered by EPCglobal Inc. (www.epcglobalinc.org).
16 device makes use of stacked-chip packaging technology provided by Sharp Corporation. This package type consists of a dedicated Altera controller chip combined with Sharp's standard flash memory die. The two chips are wire bonded in an Ultra FineLine BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. (TM) package, providing 88 balls in a compact 8mm x 11mm footprint. The Ultra FineLine BGA technology, first introduced by Altera in its MAX(R) 7000B family, uses 0.8mm spacing between balls, thereby allowing more pins per given area.

"Altera's use of stacked-chip technology for configuration devices saves designers over 60 percent in board space requirements," said Steve Mensor, Altera director of product marketing. "The new EPC16 device gives system-on-a-programmable-chip (SOPC SOPC System on a Programmable Chip
SOPC Special Operations Preparation Course
SOPC Second-Order Power Control
SOPC Shuttle Operations and Planning Center
SOPC 1-Stearoyl-2-Oleoyl-Sn-Glycero-3-Phosphatidylcholine
SOPC Shaastra Online Programming Contest
) designers the simplest configuration solution and the smallest board space for PLD (Programmable Logic Device) Refers to a variety of logic chips that are programmable at the customer's site, the customer being the vendor of the finished chip, not the end user.  configuration."

"Sharp is a volume and technology leader in stacked CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP.

(2) (Commerce Service P
 since we introduced it in 1998," said Morihiro Kada, Department General Manager of Package Development Department at Sharp Corporation. "Stacked CSP technology provides best chip to package ratio and Altera's configuration devices can utilize the full advantage of high reliable stacked CSP as well as Sharp's standard flash memory."

New Configuration Device

The EPC16 device features a 30 megabit configuration density in a 16 megabit device by using patented data compression data compression

Process of reducing the amount of data needed for storage or transmission of a given piece of information (text, graphics, video, sound, etc.), typically by use of encoding techniques.
 technology. This device is the industry's largest in-system programmability (ISP (1) See in-system programmable.

(2) (Internet Service Provider) An organization that provides access to the Internet. Connection to the user is provided via dial-up, ISDN, cable, DSL and T1/T3 lines.
) configuration device and offers advanced features to enhance SOPC design experience.

These features include a parallel configuration capability to accelerate configuration times, the introduction of page mode to allow the user to store multiple configurations, block protection for partial reprogramming Reprogramming refers to erasure and remodeling of epigenetic marks, such as DNA methylation, during mammalian development[1]. After fertilization some cells of the newly formed embryo migrate to the germinal ridge and will eventually become the germ cells  support, and full clocking flexibility through the programmable clock and external clock features. Furthermore, unused portions of the EPC16 flash memory can be used as general purpose memory via a built-in processor access feature. This advanced feature set enhances the overall PLD design experience while improving manufacturability for a high volume environment.

About Sharp

Sharp Corporation is a worldwide developer of innovative products and core technologies that play a key role in shaping the future of electronics. As a leader in liquid crystal displays liquid crystal display (LCD)

Optoelectronic device used in displays for watches, calculators, notebook computers, and other electronic devices. Current passed through specific portions of the liquid crystal solution causes the crystals to align, blocking the passage of light.
 (LCDs) and semiconductors including flash memory and packaging technology, Sharp offers one of the broadest and most advanced lines of consumer electronics, office equipment and electronic components while creating new network businesses. Dedicated to improving people's lives through the use of advanced technology combined with quality, value, and innovative design, Sharp provides a variety of creative solutions designed to help increase productivity while providing functionality to meet customer demand. Sharp Corporation currently employs about 49,600 people in the world and has recorded consolidated annual sales of over 1,854.7 billion yen for the fiscal year ended March 31, 2000. For more information, please visit Sharp's Web site at http://sharp-world.com/index.html.

About Altera

Altera Corporation, The Programmable Solutions Company(R), was founded in 1983 and is a leading supplier of programmable logic devices (PLDs). Altera's CMOS-based PLDs are user-programmable semiconductor chips that enhance flexibility and reduce time-to-market for companies in the communications, computer peripheral, and industrial markets. By using high performance devices, software development tools, and sophisticated intellectual property cores, system-on-a-programmable-chip (SOPC) solutions can be created with embedded processors, memory, and other complex logic together on a single PLD. Altera common stock is traded on The Nasdaq Stock Market Nasdaq stock market

The first electronic stock market listing over 5000 companies. The Nasdaq stock market comprises two separate markets, namely the Nasdaq National Market, which trades large, active securities and the Nasdaq Smallcap Market that trades emerging growth companies.
 under the symbol ALTR. More information on Altera is available on the Internet at http://www.altera.com.

Altera, The Programmable Solutions Company, FineLine BGA, MAX, and specific device designations are trademarks and/or service marks of Altera Corporation in the U.S. and other countries. All other trademarks are the property of their respective holders.
COPYRIGHT 2001 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Date:Mar 5, 2001
Words:653
Previous Article:Estonian Carrier AS Eesti Telefon Selects Airspan Networks for Wireless DSL Deployment.
Next Article:BakBone Software, Nishan Systems Announce Joint Marketing Alliance For IP-Based Network Storage.
Topics:



Related Articles
Altera Enhances Performance Leadership Through Array Driver Technology.
Now Available from Altera: The Industry's Largest ISP Configuration Device.
2001 Semiconductor Packaging and Assembly Outlook.
Fujitsu Delivers Industry's First Copper FCBGA Packaging to Altera Corporation.
Stacked die CSPs see double digit growth.
The slow road to recovery: optimism and advanced packaging will help lead us out of the slump.
Wafer-level packaging today: WLP represents one of the most exciting and innovative frontiers in the packaging industry.
Is SiP haunted by the MCM ghost? Thanks to cellphones, stacked-die packages are ringing up gains.
3-D packaging gets ready for prime time: among the benefits: improved RC delay and power consumption.
Front-end and back-end boundary blurs: SemiCon West shows an increasing number of devices packaged at the wafer level.

Terms of use | Copyright © 2012 Farlex, Inc. | Feedback | For webmasters | Submit articles