Alpine Microsystems Pte. Ltd. and Ellipsiz Ltd Establish Substrate Wafer Fab Manufacturing Center in Singapore.Business Editors, High-Tech Writers CAMPBELL, Calif.--(BUSINESS WIRE)--Feb. 5, 2001 New Company to be Called MicroRoutes; Joint Venture Will Manufacture Alpine's Patented MicroBoard(R) Silicon Substrates for Portable Digital and Internet Internet Publicly accessible computer network connecting many smaller networks from around the world. It grew out of a U.S. Defense Department program called ARPANET (Advanced Research Projects Agency Network), established in 1969 with connections between computers at the Infrastructure Products Alpine ALPINE Antihypertensive Treatment and Lipid Profile in a North of Sweden Efficacy Evaluation (drug trial) ALPINE Advanced Logistics Program Integration and Engineering Microsystems, a designer and manufacturer of System in Package (SiP) products for the electronics industry based in Campbell, California Campbell (IPA: /ˈkæmbəl/) is a city in Santa Clara County, California, part of Silicon Valley, in the San Francisco Bay Area. [2] As of 2007 population estimates, Campbell's population is 39,200. , today announced a joint manufacturing venture with Singapore-based Ellipsiz Ltd (formerly SingaTrust Limited) to build a silicon substrate The base layer of a structure such as a chip, multichip module (MCM), printed circuit board or disk platter. Silicon is the most widely used substrate for chips. Fiberglass (FR4) is mostly used for printed circuit boards, and ceramic is used for MCMs. wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. fab in that country. Scheduled to launch in Q2 2001, the joint venture will be called MicroRoutes and will provide capacity for the manufacture of Alpine's patented MicroBoard silicon substrates for use in portable digital and Internet infrastructure products that rely on SiP technology. "The formation of MicroRoutes reflects our shared vision for the rapid emergence of the SiP market and the need for dedicated processing technology," said Buck Buck after murder of his master, leads wolf pack. [Am. Lit.: The Call of the Wild] See : Dogs Buck clever and temerarious dog perseveres in the Klondike. [Am. Lit.: Call of the Wild] See : Resourcefulness Feltman, Executive Vice President of Alpine Microsystems, Inc. and a director of MicroRoutes. "This joint manufacturing venture will provide the capacity required to supply our key customers with MicroBoard silicon substrates for upcoming SiP products this year." "MicroRoutes will fill a key niche in the global electronics supply chain," said Pao Ning-Yu, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Ellipsiz Ltd. "With Alpine's state-of-the-art SiP technology and the cutting-edge high-yielding wafer-bumping processes developed by Ellipsiz, we are in a strong position to provide a superior advanced packaging solution. This is particularly attractive to manufacturers in the Asia Pacific and beyond who are developing the next generation of smaller, lighter and more efficient mobile products." This announcement marks Alpine's growing investment and presence in Singapore. The company established Alpine Microsystems Pte. Ltd. in October 2000 to provide regional sales, marketing, research and development, and manufacturing operations Manufacturing operations concern the operation of a facility, as opposed to maintenance, supply and distribution, health, and safety, emergency response, human resources, security, information technology and other infrastructural support organizations. , including a customer design and applications center in Singapore. This subsidiary provides Alpine Microsystems with a regional presence in Singapore, an area known for excellence in IC manufacturing and assembly, as well as an operations base for serving Asian markets and customers. MicroRoutes' first SiP products manufactured in the Singapore center will be announced later this year. About Ellipsiz The Ellipsiz Group is a leading engineering and manufacturing solutions provider to the semiconductor industry in Asia. The holding company, Ellipsiz Ltd, was listed on the main board of the Stock Exchange of Singapore Stock Exchange of Singapore (SES) The only stock exchange in Singapore. in July 2000 as SingaTrust Limited. In January 2001, it effected a name change to Ellipsiz Ltd. Among its engineering solutions are the integration of semiconductor equipment, materials, IT and other technologies for wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. processes; integrate-operate-transfer quality and reliability assurance laboratories; and total chemicals and other facilities management The management of a user's computer installation by an outside organization. All operations including systems, programming and the datacenter can be performed by the facilities management organization on the user's premises. services. It also offers advanced packaging services such as wafer bumping Bumping can refer to:
The Group has operations in Singapore, Malaysia, the Philippines, Taiwan, China and the USA. It had revenues of S$86.6 million in its last financial year, ending in June 2000. More information on the Group is posted on its web site at www.singatrust.com. About Alpine Microsystems Founded in 1995, Alpine Microsystems is a privately held semiconductor company located in Campbell, California. Alpine's patented MicroBoard substrate and DirectAttach(R) array packaging technology for System in Package products in custom and standard component configurations for manufacturers of electronic equipment. System in Package solutions offer more integration, performance and flexibility than System-on-a-Chip (SoC) approaches with significantly accelerated time to market. Alpine has received key patents in the US, Taiwan and Singapore and has more than 35 patents pending in the U.S. and foreign countries. For more information, visit the Alpine web site at www.alpinemicro.com. Alpine Microsystems, MicroBoard, MicroPallet, DirectAccess, and DirectAttach are registered trademarks of Alpine Microsystems, Inc. All other trademarks and registered trademarks are property of their respective holders. |
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