Alpine Microsystems Finalizes U.S. $10 Million Venture Funding Round.Business/High Tech Editors CAMPBELL, Calif.--(BUSINESS WIRE)--June 26, 2000 Blue Chip Ventures and United Overseas Bank of Singapore Investment Signals Emergence of System in Package (SiP) Market and Facilitates Expansion of Alpine's Manufacturing Capacity Alpine Microsystems, a designer and manufacturer of System in Package products for the electronics industry, announced it has completed a major funding round of U.S. $10 million from Blue Chip Venture Company of Cincinnati, Ohio “Cincinnati” redirects here. For other uses, see Cincinnati (disambiguation). Cincinnati is a city in the U.S. state of Ohio and the county seat of Hamilton County. and United Overseas Bank of Singapore. Previously funded by private and corporate investors, Alpine will use the proceeds to expand manufacturing capacity for upcoming products. John H. Wyant, managing director of Blue Chip, has also joined Alpine's Board of Directors. Alpine's MicroBoard(R) System in Package products use a silicon-based integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) technology that combines complete, individual components onto a multiple substrate solution. The result provides high-bandwidth integration, low cost, fast time to market, and an ease of design that is not found in single or multi-component-based implementations. This technology can be used in CPU CPU in full central processing unit Principal component of a digital computer, composed of a control unit, an instruction-decoding unit, and an arithmetic-logic unit. modules for portable and desktop PCs, in servers for SAN, web cache (1) A computer system in a network that keeps copies of the most-recently requested Web pages in memory or on disk in order to speed up retrieval. If the next page requested has already been stored in the cache, it is retrieved locally rather than from the Internet. and multicast applications, and in network processor integration for Layer 3 switching and electro-optical PHY See physical layer and physical. integration. "System in Package is emerging as an exciting market alternative to traditional SoC solutions and will grow to a multi-billion market in the next few years," said Sam Brown Sam Brown may refer to:
The channel bandwidths needed to transmit various types of signals, using various processing schemes. Every signal observed in practice can be expressed as a sum (discrete or over a frequency continuum) of sinusoidal in the computer and communications product space." About Alpine Microsystems Founded in 1995, Alpine Microsystems is a privately held semiconductor company located in Campbell, CA. Alpine's patented MicroBoard substrate and DirectAttach(R) array packaging technology for System in Package products provide a number of solutions to manufacturers of electronic equipment and offers a more flexible alternative than System-on-a-Chip (SoC) designs. OEMs can increase system bandwidth, reduce size, and maintain a flexible, fast time to market manufacturing solution. For more information, visit the Alpine web site at www.alpinemicro.com. Alpine Microsystems, MicroBoard, MicroPallet, DirectAccess, and DirectAttach are registered trademarks of Alpine Microsystems, Inc. All other trademarks and registered trademarks are property of their respective holders. |
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