Browse Semiconductor industry topic

Alliances and partnerships subtopic

Articles 1-100 out of 100 article(s) Title Author Type Date Words Battelle to Serve as Core Partner in National Effort to Advance Stem Education Goals Outlined Today by the White House. Nov 23, 2009 406 United States: Intel, NEC collaborate to flex supercomputing might. Nov 18, 2009 323 United States : Intel unveils supercomputer chip, NEC partnership. Nov 17, 2009 389 TSMC's Chang: no intention to cooperate with SMIC. Brief article Nov 13, 2009 231 Cypress Envirosystems and Invensys Form Technology Alliance to Deliver Energy-Efficient Monitoring and Control Solutions to Industrial and Commercial Facilities. Nov 12, 2009 1287 Germany : TSMC and Infineon extend technology partnership. Nov 6, 2009 181 Taiwan : CSR, TSMC collaborate on 40-nm RF process. Nov 6, 2009 128 Taiwan : Infineon and TSMC Extend Technology And Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications. Nov 6, 2009 443 United States: Cypress Envirosystems Partners with Adura. Nov 6, 2009 324 TSMC, Infineon collaborate on 65nm embedded flash process. Nov 6, 2009 330 VIA poised to challenge Mediatek in 4G wireless chip race. Brief article Nov 5, 2009 205 China: AE Introduces Solaron 250 Inverter; Announces Alliance with SGEG in China. Nov 2, 2009 238 United Kingdom : CSR signs new partnership deals for Bluetooth chips. Nov 2, 2009 156 Taiwan: MediaTek Adopts Carbon Design s System-Level Modeling Tools. Nov 2, 2009 181 MediaTek Adopts Carbon Design's System-Level Modeling Tools. Oct 30, 2009 405 Georgia: Intersil and the Georgia Institute of Technology Announce Joint Alliance for High-Performance Semiconductor Development. Oct 29, 2009 431 United States: STMicroelectronics and ARM Team Up To Power Next-Generation Home Entertainment. Oct 29, 2009 439 United States: Cypress, Adura Team up for Building Management. Oct 29, 2009 350 United States : Designing a Data Center for the Future. Oct 23, 2009 200 United States : Itox partners Systium for embedded system. Oct 21, 2009 234 United States : SAP Preps For Cloud Future Via New Intel Partnership. Oct 21, 2009 283 Sequans Communications And Mformation Announce Interoperability Partnership in Support of WiMAX Device Management. Oct 20, 2009 804 Taiwan : TSMC, SVTC tie up to boost chip design. Oct 19, 2009 246 Taiwan: TSMC, SVTC collaborate on fast-track chip design. Oct 16, 2009 251 NXP and Virage Logic Strategic Alliance Accelerates NXP's Move to High Performance Mixed Signal Leadership and Further Establishes Virage Logic as an IP Power House. Oct 12, 2009 1747 AMD expands engineering alliance with CyberLink Corp. Oct 9, 2009 171 Taiwan: GLOBALFOUNDRIES Partners with ARM for 28nm SoC Products. Oct 8, 2009 333 United States : IPtronics, Avago chip in to Intel s optical interconnect. Oct 5, 2009 213 United States : WinMagic Partners With Intel On Full-Disk Security. Oct 5, 2009 374 IPextreme[R] Announces Partnership With Toppan Printing to Provide Easy Access to Freescale and National Semiconductor Microprocessor IP Cores. Sep 15, 2009 550 United Kingdom : Cypress Partners with ARM for Next-Generation Embedded Platform Solutions. Sep 11, 2009 273 Amtran teams up with Everlight on LED packaging. Sep 10, 2009 380 Cypress Partners with ARM for Next-Generation Embedded Platform Solutions. Sep 10, 2009 570 United States: Broadcom Partners with SoftAtHome to Deliver Complete High Performance Hybrid IP Set-Top Box Solutions. Company overview Sep 9, 2009 435 United States : Ikanos Partners With ASSIA, Leader in DSL Dynamic Spectrum Management. Sep 8, 2009 457 United States: Ikanos Partners With ASSIA, Leader in DSL Dynamic Spectrum Management. Sep 8, 2009 458 Germany: T-Mobile and Sierra Wireless form M2M alliance. Sep 4, 2009 180 TSMC, Fujitsu microelectronics to collaborate on 28nm process technology. Brief article Sep 2, 2009 270 China Mobile, Mediatek to jointly produce TD-SCAMA chips. Brief article Sep 1, 2009 274 France: Melexis and BFi OPTiLAS Partner on European Distribution of Wireless Integrated Circuits. Aug 29, 2009 189 Japan: Dongwoon Anatech Selects Tower Semiconductor as Sole Manufacturing Partner for LED Drivers. Aug 7, 2009 485 KOrea : Dongwoon Anatech, Tower Partner for Manufacture of LED Lighting Devices. Aug 6, 2009 242 Dongwoon Anatech Selects Tower Semiconductor as Sole Manufacturing Partner for High Volume LED Lighting Devices. Aug 5, 2009 975 PDF SOLUTIONS/TIBCO SOFTWARE UNVEIL DATAPOWER VSF. Aug 1, 2009 710 Micron, IDT Form Alliance to Develop Solid-State Drive for Servers. Brief article Jul 29, 2009 185 IDT and Micron Form Alliance to Develop PCI Express[R] Enterprise Solid-State Drive Solutions. Jul 27, 2009 505 Microsoft, Intel design Windows 7 to be speedy. Jul 26, 2009 685 Barnes & Noble to be exclusive provider for Plastic Logic eReader device. Brief article Jul 22, 2009 77 Zacks Analyst Blog Highlights: Intel Corp, ARM Holdings, Advanced Micro Devices, Qualcomm and Texas Instruments. Jul 20, 2009 674 United States: Lenovo Exclusive Hardware Partner for MSU Phase 3. Jul 18, 2009 94 Taiwan : NXP and TSMC Join Hands to Deliver Single-Chip 45nm LCD TV Platform. Jul 14, 2009 400 India: Intel signs alliance with Phi Group for WiMax foray. Jul 11, 2009 259 United States: Semiconductor manufacturer partners with energy industry solution providers to meet smart meter demand. Jul 11, 2009 213 India: Russian Telco Yota To Enter India's Wimax Scene. Jul 8, 2009 247 United States: Magma Partners With Orion Metrology to Improve Manufacturing Yields, Product Efficiency of Photovoltaic Solar Panels. Jul 7, 2009 446 United States: Peregrine expands foundry alliances. Jul 3, 2009 311 Daily Wrap Up for July 2 - Tech. Brief article Jul 2, 2009 190 Skyworks Partners with Leading Energy Providers to Meet Growing Worldwide Demand for Smart Meters. Jul 1, 2009 1048 United States: PDF Solutions(r) and TIBCO Spotfire(r) Strategic Alliance Unveils dataPOWER(r) VSF for Visual, Interactive Yield Management. Jul 1, 2009 443 I-O Corporation. Brief article Jul 1, 2009 60 PSC estimated to benefit from funding to Elpida. Brief article Jun 30, 2009 320 Intel & Nokia form alliance for mobile computing. Jun 29, 2009 247 Finland : Intel, Nokia Partner On Smartphones, Mobile Devices. Jun 25, 2009 382 United States: Intel, Nokia Announce New Mobile Phone Partnership. Jun 25, 2009 327 United States: Intel, PSU team up on $2 million Vietnam student program. Jun 25, 2009 256 United States: Intel and Nokia Announce Partnership. Jun 25, 2009 129 Intel Teams Up Again with Conan O'Brien. Jun 24, 2009 405 United States : Intel and Nokia announce mobile alliance. Jun 24, 2009 208 Intel, Nokia to define a new mobile platform. Brief article Jun 23, 2009 240 Nanometrics and ZYGO Announce Strategic Business Partnership. Jun 17, 2009 678 SunPower partners with Jabil Circuit to make solar panels in Mexico. Brief article Jun 8, 2009 185 AMD to Webcast Server Platform Q&A Session. Jun 3, 2009 142 united states : Nuance Forms Electronic Health Record Stimulus Alliance with Allscripts, Cisco, Citrix, Dell, Intel, Intuit and Microsoft. May 16, 2009 458 Nuance Forms Electronic Health Record Stimulus Alliance with Allscripts, Cisco, Citrix, Dell, Intel, Intuit and Microsoft. May 14, 2009 996 United States: WiGig fast wireless may change Wi-Fi, home networks. May 13, 2009 491 united states : Intel and Novell Collaborate on Accelerating the Moblin Adoption. May 12, 2009 333 Industry Leaders Form Wireless Gigabit Alliance to Promote 60 GHz Wireless Technology. May 7, 2009 711 United States: Celeno Partners with Texas Instruments to Enable Wireless HD for Cable HD IPTV. May 4, 2009 434 ST-Ericsson Reports Financial Results for its First Two Months of Operation. Financial report Apr 30, 2009 1134 ZTE Partners with Semtech on IEEE1588v2 Products for WiMax Basestations, IP Backhaul and Femtocells. Apr 27, 2009 432 Research and Markets: Implications of the Strategic Alliance between Intel and TSMC. Apr 22, 2009 289 IBM technology alliance unveils 28nm low power semiconductor technology. Apr 20, 2009 380 Sun advances partnership with Intel; extends design and innovation with next generation Intel XEON based server-portfolio. Apr 20, 2009 647 United States: IBM Alliance Looks To Top Intel With 28-Nm Chips. Apr 18, 2009 390 Lifespan's Technology Relieves Healthcare Headaches. Apr 8, 2009 384 United States: GE And Intel To Form Healthcare Alliance. Apr 4, 2009 453 PLX Technology and Fusion-io Form Alliance on Revolutionary PCI Express-Based SSD Products. Mar 30, 2009 704 Ciranova and TSMC Announce Strategic Partnership on Advanced PDK Technology. Mar 24, 2009 550 Sarnoff Europe Announces Silicon Proven ESD Cells for UMC 65nm, 0.13um CMOS and 0.18um HV CMOS Under New Low-cost Business Model. Mar 23, 2009 528 Global CyberSoft Joins Simax Semiconductor Alliance. Company overview Mar 16, 2009 464 AMD sells 50 millionth chip. Mar 11, 2009 141 Seagate demo high-speed Serial ATA. Brief article Mar 9, 2009 134 NEXX Systems Announces Electroplating Process & Equipment Development Collaboration for Advanced Semiconductor Packaging. Mar 9, 2009 349 GSA and MOS-AK Merge Efforts to Form the GSA Modeling Working Group. Mar 4, 2009 507 Virage Logic Selected by NEC Electronics as Trusted IP Partner for Advanced 40nm Technologies. Mar 2, 2009 379 United States: ASE Signs MOU with AMPI. Feb 25, 2009 132 SEMATECH and Asahi Glass Form Joint Development Partnership to Commercialize Defect Free EUV Mask Blanks. Feb 25, 2009 854 United States: TSMC and Tela Innovations Announce Strategic Partnership to Enhance Design and Process Co-Optimization. Feb 24, 2009 145 Agreements. Apr 1, 2002 746 AMA, Intel team up for encryption service. Jun 1, 2000 186