Printer Friendly
The Free Library
4,720,740 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Alliance Introduces DDR Support Solutions for JEDEC Memory Modules; Full JEDEC Compliant Support Silicon for Buffered / Registered DIMM's.


SANTA CLARA, Calif. -- Alliance Semiconductor Corporation (NASDAQ NASDAQ
 in full National Association of Securities Dealers Automated Quotations

U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on
: ALSC ALSC Association for Library Service to Children
ALSC Adirondack Lakes Survey Corporation
ALSC Afloat Logistics and Sealift Capability
ALSC American Lumber Standards Committee, Inc.
ALSC Advanced Logistics Systems Center (AFMC) 
), a worldwide provider of Analog and Mixed Signal products, High-performance Memory products, Connectivity and Networking solutions for the communications, computing, embedded, industrial and consumer markets, announced today, the availability of its JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device  DDR I Series of fully compliant JEDEC buffered/registered DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module.

DIMM - Dual In-Line Memory Module
 support silicon.

Alliance's JEDEC DDR I Series consists of 4 devices today; the ASM5CVF857, a PLL based zero delay buffer, and three register variations in concert with the JEDEC JC40/JC45 DDR I 400 specifications; the ASM4SSTVF16857, (14 bit 1:1), the ASM4SSTVF16859 (13/26 bit 1:2), and the ASM4SSTVF32852 (24/48 bit 1:2). Designed specifically to meet and exceed the JEDEC JC40 component standards, these devices support the full mix of JEDEC defined raw cards (PCBs).

Fully compliant to the JEDEC standards, this JEDEC DDR I Series features improved waveform integrity and accuracies yielding better overall timing margins for the RDIMM RDIMM Registered Dual In-Line Memory Module
RDIMM Registered Dimm
 designer. The JEDEC standards provide the basis for a solid design, and maximum timing margins can be realized using Alliance's JEDEC DDR I Series. Improvements in overall accuracy with respect to jitter, duty cycle and Tr/Tf, combine to provide the basis for timing margin optimization. The JEDEC DDR I Series is offered in the full compliment of package options to include all the JEDEC defined PCB PCB: see polychlorinated biphenyl.
PCB
 in full polychlorinated biphenyl

Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound.
 configurations supporting: 48 and/or 64TSSOP TSSOP Thin Shrink Small Outline Package
TSSOP Thin Scale Small Outline Package
, 48TVSOP TVSOP Thin Very Small Outline Package , 40 and 56QFN, VQFN, 56PBGA and 114LFBGA LFBGA Low-Profile Fine-Pitch Ball-Grid Array
LFBGA Low Profile Fine Pitch Bga
LFBGA Leadless Fine Pitch Bga
.

"We are very pleased to augment our analog and mixed signal product portfolio with the introduction of the JEDEC DDR I Series," said Mark Sherwood, Director of Marketing for Alliance's Mixed Signal Business Unit. "This series offer the designers of DIMM modules compatibility with existing solutions on the market and improved timing margins. Alliance is an active participant member of the JEDEC JC40, JC45 and other associated committees, helping both to create and to drive these standards."

Alliance's JEDEC DDR I Series is fabricated using state-of-the-art low voltage 2.5V CMOS designs and process, and supports performance through the current DDR 400 (200MHz) standards.

The JEDEC DDR I Series includes a PLL based Zero Delay Buffer (ZDB) with differential SSTL II class II outputs. The full Series is currently in full volume production. Additional information and full data sheet specifications are available via the Alliance Semiconductor website at http://www.alsc.com/products/ddr.htm

About Alliance:

Alliance Semiconductor Corporation (NASDAQ: ALSC) is powering every application with high performance solutions for the communications, computing and consumer electronics markets. Utilizing advanced process technologies and design expertise, Alliance provides leading OEMs with a broad portfolio of complementary technologies including analog and mixed-signal products, chip-to-chip connectivity products, networking controllers and high-performance memories. Alliance addresses the complete needs of system developers by leveraging its proprietary advances in Electromagnetic Interference (EMI) reduction, power management and timing technology, HyperTransport(TM) I/O connectivity and specialized memory solutions for next-generation applications. Founded in 1985, Alliance is headquartered in Santa Clara, California Santa Clara, California (IPA: /ˌsæntəˈklærə/) , founded in 1777 and incorporated in 1852, is a city in Santa Clara County, in the U.S. state of California.  with design centers in Bangalore and Hyderabad, India. The company is publicly traded and included in the S&P 600 Index. Additional information is available on the Alliance Web site at: http://www.alsc.com.
COPYRIGHT 2004 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Nov 9, 2004
Words:524
Previous Article:Healthaxis, Inc. Announces Business Process Outsourcing Contract with Leading Clearinghouse.
Next Article:Survey: New Business Models Are Driving Finance Departments to Adopt Tools to Help Their Reporting and Forecasting Processes.
Topics:



Related Articles
Samsung Samples First JEDEC-Compliant DDR SDRAM.
Micron Technology, Inc., Announces Industry Samples of 2.5V 266MHz 256 Meg DDR SDRAMs.
SAMSUNG VOLUME SHIPPING DDR400 PC3200 MODULES NOW.(Product Announcement)
Integrated Circuit Systems, Inc. Introduces World's First PLL Clock Driver for JEDEC-Defined Registered DDR-II DIMM.
IDT Supports Next-Generation Technology With the Industry's First Chip Set for DDR-II DIMM Designs.
Elpida's 2 Gig DDR2 DIMMS deliver fast performance to server market.(Brief Article)
Integrated Circuit Systems, Inc. to Provide Advanced Memory Buffer Timing Devices for Intel's Next-Generation Fully Buffered DIMM Architecture.
IDT Samples Advanced Memory Buffer Products to Multiple FB-DIMM Suppliers; New Devices Continue IDT Leadership Position in Memory Interface Market.
Elpida Ships Fully-Buffered DIMM Samples for Advanced Performance in Next-Generation Servers; Memory Modules Provide Unparalleled Speed and Density...
Samsung delivers next gen memory modules for high density data processing.(Samsung Electronics Company Ltd.)(Brief Article)

Terms of use | Copyright © 2009 Farlex, Inc. | Feedback | For webmasters | Submit articles