Alignment system.The IQ Aligner is a fully automated system for lithography lithography (lĭthŏg`rəfē), type of planographic or surface printing. It is distinguished from letterpress (relief) printing and from intaglio printing (in which the design is cut or etched into the plate). and aligned wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. bonding. The dual-use mask and bond aligner has capabilities for top side, bottom side, large gap and darkfield alignment and is equipped with an automated handling and alignment system. The system has a small footprint design and can accommodate up to 300 mm wafer sizes. The system features aligned exposure of thick resist layers, full field proximity exposure for wafer bumping Bumping can refer to:
One micrometer, which is one millionth of a meter or approximately 1/25,000 of an inch. The tiny elements that make up a transistor on a chip are measured in micrometers and nanometers. See process technology. front to back side alignment accuracy and thin and thick resist applications. EV Group, Seharding, Austria |
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