Advantest Launches Lithography System Supporting 300mm, 65nm and Below Process Technology.
Tokyo, Japan, Oct 26, 2006 - (JCN JCN Japan Corporate News
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JCN joint communications network (US DoD) ) - Advantest Corporation announced availability on October 24 of the F3000 electron beam A stream of electrons, or electricity, that is directed towards a receiving object. See electron beam imaging and electron beam lithography. (EB) lithography system, which supports 300 mm wafer process technology and 65 nm rule devices - and smaller.
The F3000 uses a maskless lithography In maskless lithography, light used to expose the photosensitive emulsion (or photoresist) is not projected from, or transmitted through, a photomask. Instead, most commonly, the radiation is focused to a narrow beam. system employs electron beam direct writing (EBDW) technologies to draw 65 nm circuits, and smaller, on 300 mm wafers.
According to the company, the F3000 achieves an approximately 20% improvement over Advantest's previous model in image placement accuracy and critical dimension control - two of the main challenges resulting from pattern miniaturization min·i·a·tur·ize
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.
min .
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