Advanced metallization conference 2007; proceedings.9781558999923 Advanced metallization Met`al`li`za´tion n. 1. The act or process of metallizing. conference 2007; proceedings. International Conference on Advanced Metallization (2007: Albany, NY/Tokyo, Japan) Ed. by Andrew J. McKerrow et al. Materials Research Society 2008 745 pages $112.00 Hardcover TK7871 An October 2007 conference highlighted the latest R&D and manufacturing results, as well as real-world integration and reliability data, on the application of metallization and related technologies for advanced IC devices. Papers from the conference describe recent work in the field of ULSI (Ultra Large Scale Integration) More than one million transistors on a chip. See SSI, MSI, LSI and VLSI. interconnect technology including metallization, dielectrics, integration, packaging, design, and vertical integration. Papers from the conference are presented here, in sections on barrier metals and silicides, CMP CMP (cytidine monophosphate): see cytosine. (1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information and cleaning, copper deposition, design and interconnect modeling, integration, low-k, metal resistivity, packaging and 3D integration, and reliability and yield. Some specific topics include the drying effect on hydrophobic and hydrophilic hydrophilic /hy·dro·phil·ic/ (-fil´ik) readily absorbing moisture; hygroscopic; having strongly polar groups that readily interact with water. hy·dro·phil·ic adj. films by IPA IPA - International Phonetic Alphabet , optical measurement of metal film thickness, signal transmission through interconnects with repetitive loads, and evolution of grain size and crystallographic orientation in narrow lines. ([c]20082005 Book News, Inc., Portland, OR) |
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