Advanced Thermal Solutions to Present at Freescale Technology Forum.NORWOOD, Mass. -- Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that Dr. Kaveh Azar, the company's president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. will present at the Freescale Technology Forum on Thursday, July 27, 2006 at 10:45 a.m. EDT EDT abbr. Eastern Daylight Time EDT Eastern Daylight Time EDT n abbr (US) (= Eastern Daylight Time) → hora de verano de Nueva York EDT . The Forum is scheduled for July 24 through 27 at the JW Marriott and Ritz-Carlton Conference Center, Grande Lakes, in Orlando, Florida The city of Orlando is a major city in central Florida and is the county seat of Orange County, Florida. According to the 2000 census, the city population was 185,951. A 2006 U.S. . Dr. Azar's presentation, Thermal and Packaging Challenges of Hyper A Greek work meaning "above" or "more than." It is used as a prefix to technical concepts and products to convey a more advanced or more automatic capability. - Power Devices, will focus on the rapid rise of heat flux in thermal management and packaging communities and the demand for turnkey cooling solutions. Presentation attendees will hear about how to move beyond the external cooling of CPUs / ASICs and how to tackle the thermal management and packaging sides of the problem. Dr. Azar will also demonstrate ATS' maxiGRIP(TM) attachment system for safely mounting heat sinks A material that absorbs heat. Typically made of aluminum, heat sinks are widely used in amplifiers and other electronic devices that build up heat. Small heat sinks are the most economical method for cooling microprocessors and other chips. to flip chips A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done , BGAs, and other hot semiconductor products. The maxiGRIP system features a plastic frame clip that snaps securely around a component's perimeter. A spring clip runs though the heat sink's fin field and fastens securely to the plastic frame. The maxiGRIP system is very low profile, allowing its use in restricted spaces and is ideal for heat sink attachment to vertically-mounted components and devices. Slides of Dr. Azar's presentation will be available beginning at 12:00 p.m. July 27, 2006 on the Company's web site, www.qats.com. About Kaveh Azar, Ph.D. Dr. Azar is an internationally recognized expert in thermal management of electronic devices. He is a frequent speaker and lecturer in analytical and experimental methods in electronics cooling. Dr. Azar holds more than 26 U.S. and international patents, published nearly 60 articles and serves as Editor-in-Chief of Electronics Cooling Magazine. About Advanced Thermal Solutions Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of heat sinks and laboratory-grade thermal instrumentation, along with thermal design consulting services Noun 1. consulting service - service provided by a professional advisor (e.g., a lawyer or doctor or CPA etc.) service - work done by one person or group that benefits another; "budget separately for goods and services" and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com. |
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